IPC-Stelle: H05K 10/00 [Version 7 (gültig ab 01.2000)]

SymbolTypTitel
HSKELECTRICITY
H05KLELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05KUKLPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01 , H01L 27/13; non-printed means for electric connections to or between printed circuits H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)
H05K 1/00HGRPrinted circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
H05K 1/02UGR1
.Details
H05K 1/03UGR2
. .Use of materials for the substrate [3]
H05K 1/05UGR3
. . .Insulated metal substrate [3]
H05K 1/09UGR2
. .Use of materials for the metallic pattern [3]
H05K 1/11UGR2
. .Printed elements for providing electric connections to or between printed circuits [3]
H05K 1/14UGR2
. .Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11 , H01R 12/00)
H05K 1/16UGR1
.incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 1/18UGR1
.Printed circuits structurally associated with non-printed electric components (H05K 1/16 takes precedence)
H05K 3/00HGRApparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) [3]
H05K 3/02UGR1
.in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 3/04UGR2
. .the conductive material being removed mechanically, e.g. by punching
H05K 3/06UGR2
. .the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/07UGR3
. . .being removed electrolytically [3]
H05K 3/08UGR2
. .the conductive material being removed by electric discharge, e.g. by spark erosion
H05K 3/10UGR1
.in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/12UGR2
. .using printing techniques to apply the conductive material
H05K 3/14UGR2
. .using spraying techniques to apply the conductive material
H05K 3/16UGR3
. . .by cathodic sputtering
H05K 3/18UGR2
. .using precipitation techniques to apply the conductive material
H05K 3/20UGR2
. .by affixing prefabricated conductor pattern
H05K 3/22UGR1
.Secondary treatment of printed circuits
H05K 3/24UGR2
. .Reinforcing of the conductive pattern
H05K 3/26UGR2
. .Cleaning or polishing of the conductive pattern
H05K 3/28UGR2
. .Applying non-metallic protective coatings
H05K 3/30UGR1
.Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32UGR2
. .electrically connecting electric components or wires to printed circuits
H05K 3/34UGR3
. . .by soldering
H05K 3/36UGR1
.Assembling printed circuits with other printed circuits
H05K 3/38UGR1
.Improvement of the adhesion between the insulating substrate and the metal [3]
H05K 3/40UGR1
.Forming printed elements for providing electric connections to or between printed circuits [3]
H05K 3/42UGR2
. .Plated through-holes [3]
H05K 3/44UGR1
.Manufacturing insulated metal core circuits [3]
H05K 3/46UGR1
.Manufacturing multi-layer circuits [3]
H05K 5/00HGRCasings, cabinets or drawers for electric apparatus (in general A47B; radio receiver cabinets H04B 1/08; television receiver cabinets H04N 5/64)
H05K 5/02UGR1
.Details
H05K 5/03UGR2
. .Covers
H05K 5/04UGR1
.Metal casings
H05K 5/06UGR1
.Hermetically-sealed casings
H05K 7/00HGRConstructional details common to different types of electric apparatus (casings, cabinets, drawers H05K 5/00)
H05K 7/02UGR1
.Arrangements of circuit components or wiring on supporting structure
H05K 7/04UGR2
. .on conductive chassis
H05K 7/06UGR2
. .on insulating boards
H05K 7/08UGR3
. . .on perforated boards
H05K 7/10UGR2
. .Plug-in assemblages of components
H05K 7/12UGR2
. .Resilient or clamping means for holding component to structure (holding two-part couplings together H01R 13/00)
H05K 7/14UGR1
.Mounting supporting structure in casing or on frame or rack
H05K 7/16UGR2
. .on hinges or pivots
H05K 7/18UGR1
.Construction of rack or frame
H05K 7/20UGR1
.Modifications to facilitate cooling, ventilating, or heating
H05K 9/00HGRScreening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an aerial H01Q 17/00)
H05K 10/00HGRArrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar stand-by unit
H05K 11/00HGRCombinations of a radio or television receiver with apparatus having a different main function
H05K 11/02UGR1
.with vehicles
H05K 13/00HGRApparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K 13/02UGR1
.Feeding of components (in general B65G)
H05K 13/04UGR1
.Mounting of components
H05K 13/06UGR1
.Wiring by machine
H05K 13/08UGR1
.Monitoring manufacture of assemblages