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IPC-Stelle: H10N 30/00 Hauptgruppe [Version 2024.01 (aktuell), Sprache EN - English]

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Hierarchielinien

DEKLA-Gruppen

Symbol		Titel
A Hierarchieinformationen		HUMAN NECESSITIES
B Hierarchieinformationen		PERFORMING OPERATIONS; TRANSPORTING
C Hierarchieinformationen		CHEMISTRY; METALLURGY
D Hierarchieinformationen		TEXTILES; PAPER
E Hierarchieinformationen		FIXED CONSTRUCTIONS
F Hierarchieinformationen		MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G Hierarchieinformationen		PHYSICS
H Hierarchieinformationen		ELECTRICITY
H01 Hierarchieinformationen		ELECTRIC ELEMENTS
H02 Hierarchieinformationen		GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
H03 Hierarchieinformationen		ELECTRONIC CIRCUITRY
H04 Hierarchieinformationen		ELECTRIC COMMUNICATION TECHNIQUE
H05 Hierarchieinformationen		ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H10 Hierarchieinformationen		SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR [2023.01]
H10B Hierarchieinformationen		ELECTRONIC MEMORY DEVICES [2023.01]
H10K Hierarchieinformationen		ORGANIC ELECTRIC SOLID-STATE DEVICES [2023.01]
H10N Hierarchieinformationen		ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR [2023.01]
H10N 10/00		Thermoelectric or thermomagnetic devices [2023.01]
H10N 10/00 Hierarchieinformationen		Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects (integrated devices or assemblies of multiple devices H10N 19/00) [2023.01]
H10N 15/00 Hierarchieinformationen		Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect (integrated devices or assemblies of multiple devices H10N 19/00) [2023.01]
H10N 19/00 Hierarchieinformationen		Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N 10/00-H10N 15/00 [2023.01]
H10N 30/00		Piezoelectric, electrostrictive or magnetostrictive devices [2023.01]
H10N 30/00 Hierarchieinformationen		Piezoelectric or electrostrictive devices (integrated devices or assemblies of multiple devices H10N 39/00) [2023.01]
H10N 30/01 Hierarchieinformationen		. Manufacture or treatment [2023.01]
H10N 30/02 Hierarchieinformationen		. . Forming enclosures or casings [2023.01]
H10N 30/03 Hierarchieinformationen		. . Assembling devices that include piezoelectric or electrostrictive parts [2023.01]
H10N 30/04 Hierarchieinformationen		. . Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning [2023.01]
H10N 30/045 Hierarchieinformationen		. . . by polarising [2023.01]
H10N 30/05 Hierarchieinformationen		. . Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes [2023.01]
H10N 30/053 Hierarchieinformationen		. . . by integrally sintering piezoelectric or electrostrictive bodies and electrodes [2023.01]
H10N 30/057 Hierarchieinformationen		. . . by stacking bulk piezoelectric or electrostrictive bodies and electrodes [2023.01]
H10N 30/06 Hierarchieinformationen		. . Forming electrodes or interconnections, e.g. leads or terminals [2023.01]
H10N 30/063 Hierarchieinformationen		. . . Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts [2023.01]
H10N 30/067 Hierarchieinformationen		. . . Forming single-layered electrodes of multilayered piezoelectric or electrostrictive parts [2023.01]
H10N 30/07 Hierarchieinformationen		. . Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base [2023.01]
H10N 30/071 Hierarchieinformationen		. . . Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate [2023.01]
H10N 30/072 Hierarchieinformationen		. . . by laminating or bonding of piezoelectric or electrostrictive bodies [2023.01]
H10N 30/073 Hierarchieinformationen		. . . . by fusion of metals or by adhesives [2023.01]
H10N 30/074 Hierarchieinformationen		. . . by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing [2023.01]
H10N 30/076 Hierarchieinformationen		. . . . by vapour phase deposition [2023.01]
H10N 30/077 Hierarchieinformationen		. . . . by liquid phase deposition [2023.01]
H10N 30/078 Hierarchieinformationen		. . . . . by sol-gel deposition [2023.01]
H10N 30/079 Hierarchieinformationen		. . . . using intermediate layers, e.g. for growth control [2023.01]
H10N 30/08 Hierarchieinformationen		. . Shaping or machining of piezoelectric or electrostrictive bodies [2023.01]
H10N 30/081 Hierarchieinformationen		. . . by coating or depositing using masks, e.g. lift-off [2023.01]
H10N 30/082 Hierarchieinformationen		. . . by etching, e.g. lithography [2023.01]
H10N 30/084 Hierarchieinformationen		. . . by moulding or extrusion [2023.01]
H10N 30/085 Hierarchieinformationen		. . . by machining [2023.01]
H10N 30/086 Hierarchieinformationen		. . . . by polishing or grinding [2023.01]
H10N 30/088 Hierarchieinformationen		. . . . by cutting or dicing [2023.01]
H10N 30/089 Hierarchieinformationen		. . . . by punching [2023.01]
H10N 30/09 Hierarchieinformationen		. . Forming piezoelectric or electrostrictive materials [2023.01]
H10N 30/092 Hierarchieinformationen		. . . Forming composite materials [2023.01]
H10N 30/093 Hierarchieinformationen		. . . Forming inorganic materials [2023.01]
H10N 30/095 Hierarchieinformationen		. . . . by melting [2023.01]
H10N 30/097 Hierarchieinformationen		. . . . by sintering [2023.01]
H10N 30/098 Hierarchieinformationen		. . . Forming organic materials [2023.01]
H10N 30/20 Hierarchieinformationen		. with electrical input and mechanical output, e.g. functioning as actuators or vibrators [2023.01]
H10N 30/30 Hierarchieinformationen		. with mechanical input and electrical output, e.g. functioning as generators or sensors [2023.01]
H10N 30/40 Hierarchieinformationen		. with electrical input and electrical output, e.g. functioning as transformers [2023.01]
H10N 30/50 Hierarchieinformationen		. having a stacked or multilayer structure [2023.01]
H10N 30/60 Hierarchieinformationen		. having a coaxial cable structure [2023.01]
H10N 30/80 Hierarchieinformationen		. Constructional details [2023.01]
H10N 30/85 Hierarchieinformationen		. . Piezoelectric or electrostrictive active materials [2023.01]
H10N 30/853 Hierarchieinformationen		. . . Ceramic compositions [2023.01]
H10N 30/857 Hierarchieinformationen		. . . Macromolecular compositions [2023.01]
H10N 30/87 Hierarchieinformationen		. . Electrodes or interconnections, e.g. leads or terminals [2023.01]
H10N 30/88 Hierarchieinformationen		. . Mounts; Supports; Enclosures; Casings [2023.01]
H10N 35/00 Hierarchieinformationen		Magnetostrictive devices (integrated devices or assemblies of multiple devices H10N 39/00) [2023.01]
H10N 39/00 Hierarchieinformationen		Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N 30/00-H10N 35/00 [2023.01]
H10N 50/00		Galvanomagnetic or similar magnetic-effect devices [2023.01]
H10N 50/00 Hierarchieinformationen		Galvanomagnetic devices (Hall-effect devices H10N 52/00; integrated devices or assemblies of multiple devices H10N 59/00) [2023.01]
H10N 52/00 Hierarchieinformationen		Hall-effect devices (integrated devices or assemblies of multiple devices H10N 59/00) [2023.01]
H10N 59/00 Hierarchieinformationen		Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N 50/00-H10N 52/00 (MRAM devices H10B 61/00) [2023.01]
H10N 60/00		Superconducting devices [2023.01]
H10N 60/00 Hierarchieinformationen		Superconducting devices (integrated devices or assemblies of multiple devices H10N 69/00) [2023.01]
H10N 69/00 Hierarchieinformationen		Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N 60/00 [2023.01]
H10N 70/00		Other electric solid-state devices [2023.01]
H10N 70/00 Hierarchieinformationen		Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching (integrated devices or assemblies of multiple devices H10N 79/00) [2023.01]
H10N 79/00 Hierarchieinformationen		Integrated devices, or assemblies of multiple devices, comprising at least one solid-state element covered by group H10N 70/00 (ReRAM devices H10B 63/00; PCRAM devices H10B 63/10) [2023.01]
H10N 80/00 Hierarchieinformationen		Bulk negative-resistance effect devices (integrated devices or assemblies of multiple devices H10N 89/00) [2023.01]
H10N 89/00 Hierarchieinformationen		Integrated devices, or assemblies of multiple devices, comprising at least one bulk negative resistance effect element covered by group H10N 80/00 [2023.01]
H10N 97/00 Hierarchieinformationen		Electric solid-state thin-film or thick-film devices, not otherwise provided for [2023.01]
H10N 99/00
H10N 99/00 Hierarchieinformationen		Subject matter not provided for in other groups of this subclass [2023.01]
H99 Hierarchieinformationen		SUBJECT MATTER NOT OTHERWISE PROVIDED FOR IN THIS SECTION [2006.01]

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