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Symbol IPC-Stellen auswählen Titel
A
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HUMAN NECESSITIES
B
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PERFORMING OPERATIONSTRANSPORTING
C
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CHEMISTRYMETALLURGY
D
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TEXTILESPAPER
E
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FIXED CONSTRUCTIONS
F
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MECHANICAL ENGINEERINGLIGHTINGHEATINGWEAPONSBLASTING
G
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PHYSICS
H
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ELECTRICITY
H01
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ELECTRIC ELEMENTS
H02
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GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
H03
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ELECTRONIC CIRCUITRY
H04
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ELECTRIC COMMUNICATION TECHNIQUE
H05
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ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H10
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SEMICONDUCTOR DEVICESELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR [2023.01]
H10B
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ELECTRONIC MEMORY DEVICES [2023.01]
H10D
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INORGANIC ELECTRIC SEMICONDUCTOR DEVICES [2025.01]
H10F
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INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION [2025.01]
H10H
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INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS [2025.01]
H10H 20/00
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Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED] [2025.01]
H10H 29/00
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Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H 20/00 [2025.01]
H10H 29/01
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Manufacture or treatment [2025.01]
H10H 29/02
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. . using pick-and-place processes [2025.01]
H10H 29/03
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. . using mass transfer of LEDs, e.g. by using liquid suspensions [2025.01]
H10H 29/10
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Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H 20/00 (active-matrix LED displays H10H 29/30) [2025.01]
H10H 29/14
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. . comprising multiple light-emitting semiconductor components [2025.01]
H10H 29/20
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Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H 20/00 (active-matrix LED displays H10H 29/30) [2025.01]
H10H 29/24
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. . comprising multiple light-emitting semiconductor devices [2025.01]
H10H 29/30
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Active-matrix LED displays [2025.01]
H10H 29/32
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. . characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel [2025.01]
H10H 29/34
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. . characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels [2025.01]
H10H 29/37
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. . Pixel-defining structures, e.g. banks between the LEDs [2025.01]
H10H 29/39
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. . Connection of the pixel electrodes to the driving transistors [2025.01]
H10H 29/41
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. . Insulating layers formed between the driving transistors and the LEDs [2025.01]
H10H 29/45
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. . comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates [2025.01]
H10H 29/49
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. . Interconnections, e.g. wiring lines or terminals (connection of the pixel electrodes to the driving transistors H10H 29/39) [2025.01]
H10H 29/80
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Constructional details [2025.01]
H10H 29/85
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. . Packages [2025.01]
H10H 29/851
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. . . Wavelength conversion means [2025.01]
H10H 29/852
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. . . Encapsulations [2025.01]
H10H 29/853
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. . . . characterised by their shape [2025.01]
H10H 29/854
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. . . . characterised by their material, e.g. epoxy or silicone resins [2025.01]
H10H 29/855
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. . . Optical field-shaping means, e.g. lenses [2025.01]
H10H 29/856
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. . . . Reflecting means [2025.01]
H10H 99/00
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Subject matter not provided for in other groups of this subclass [2025.01]
H10K
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ORGANIC ELECTRIC SOLID-STATE DEVICES [2023.01]
H10N
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ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR [2023.01]
H99
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SUBJECT MATTER NOT OTHERWISE PROVIDED FOR IN THIS SECTION [2006.01]

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