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Symbol IPC-Stellen auswählen Titel
A
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HUMAN NECESSITIES
B
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PERFORMING OPERATIONSTRANSPORTING
C
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CHEMISTRYMETALLURGY
D
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TEXTILESPAPER
E
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FIXED CONSTRUCTIONS
F
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MECHANICAL ENGINEERINGLIGHTINGHEATINGWEAPONSBLASTING
G
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PHYSICS
H
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ELECTRICITY
H01
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ELECTRIC ELEMENTS
H01B
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CABLESCONDUCTORSINSULATORSSELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F 1/00; waveguides H01P)
H01C
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RESISTORS
H01F
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MAGNETSINDUCTANCESTRANSFORMERSSELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES [2]
H01G
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CAPACITORSCAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B 3/00; capacitors having potential barriers H01L 29/00)
H01H
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ELECTRIC SWITCHESRELAYSSELECTORSEMERGENCY PROTECTIVE DEVICES (contact cables H01B 7/10;  electrolytic self-interrupters H01G 9/18;  emergency protective circuit arrangements H02H;  switching by electronic means without contact-making H03K 17/00)
H01J
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ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; arc lamps with consumable electrodes H05B; particle accelerators H05H)
H01K
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ELECTRIC INCANDESCENT LAMPS (details, apparatus or processes for manufacture applicable to both discharge devices and incandescent lamps H01J;  light sources using a combination of incandescent and other types of light generation H01J 61/96, H05B 35/00)
H01L
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SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 (use of semiconductor devices for measuring G01;  resistors in general H01C;  magnets, inductors or transformers H01F;  capacitors in general H01G;  electrolytic devices H01G 9/00;  batteries or accumulators H01M;  waveguides, resonators or lines of the waveguide type H01P;  line connectors or current collectors H01R;  stimulated-emission devices H01S;  electromechanical resonators H03H;  loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R;  electric light sources in general H05B;  printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K;  use of semiconductor devices in circuits having a particular application, see the subclass for the application) [2]
H01M
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PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY [2]
H01P
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WAVEGUIDESRESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
H01Q
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ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B 6/72)
H01R
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ELECTRICALLY-CONDUCTIVE CONNECTIONSSTRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTSCOUPLING DEVICESCURRENT COLLECTORS
H01S
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DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHTDEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
H01S 1/00
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Masers, i.e. devices using stimulated emission of electromagnetic radiation in the microwave range [1, 2006.01]
H01S 3/00
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Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range (semiconductors lasers H01S 5/00) [1, 2006.01]
H01S 4/00
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Devices using stimulated emission of electromagnetic radiation in wave ranges other than those covered by groups H01S 1/00, H01S 3/00 or H01S 5/00, e.g. phonon masers, X-ray lasers or gamma-ray lasers [1, 2006.01]
H01S 5/00
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Semiconductor lasers (superluminescent diodes H01L 33/00) [7, 2006.01]
H01S 5/02
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Structural details or components not essential to laser action [7, 2006.01]
H01S 5/022
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. . MountingsHousings [7, 2006.01, 2021.01]
H01S 5/02208
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. . . characterised by the shape of the housings [2021.01]
H01S 5/02212
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. . . . Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis [2021.01]
H01S 5/02216
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. . . . Butterfly-type, i.e. with electrode pins extending horizontally from the housings [2021.01]
H01S 5/02218
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. . . Material of the housingsFilling of the housings [2021.01]
H01S 5/0222
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. . . . Gas-filled housings [2021.01]
H01S 5/02224
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. . . . . the gas comprising oxygen, e.g. for avoiding contamination of the light emitting facets [2021.01]
H01S 5/02232
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. . . . Liquid-filled housings [2021.01]
H01S 5/02234
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. . . . Resin-filled housingsthe housings being made of resin [2021.01]
H01S 5/02235
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. . . Getter material for absorbing contamination [2021.01]
H01S 5/0225
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. . . Out-coupling of light [2021.01]
H01S 5/02251
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. . . . using optical fibres [2021.01]
H01S 5/02253
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. . . . using lenses [2021.01]
H01S 5/02255
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. . . . using beam deflecting elements [2021.01]
H01S 5/02257
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. . . . using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing [2021.01]
H01S 5/023
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. . . Mount members, e.g. sub-mount members [2021.01]
H01S 5/0231
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. . . . Stems [2021.01]
H01S 5/02315
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. . . . Support members, e.g. bases or carriers [2021.01]
H01S 5/0232
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. . . . Lead-frames [2021.01]
H01S 5/02325
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. . . . Mechanically integrated components on mount members or optical micro-benches [2021.01]
H01S 5/02326
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. . . . . Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses [2021.01]
H01S 5/0233
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. . . Mounting configuration of laser chips [2021.01]
H01S 5/02335
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. . . . Up-side up mountings, e.g. epi-side up mountings or junction up mountings [2021.01]
H01S 5/0234
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. . . . Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings [2021.01]
H01S 5/02345
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. . . . Wire-bonding [2021.01]
H01S 5/0235
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. . . Method for mounting laser chips [2021.01]
H01S 5/02355
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. . . . Fixing laser chips on mounts [2021.01]
H01S 5/0236
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. . . . . using an adhesive [2021.01]
H01S 5/02365
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. . . . . by clamping [2021.01]
H01S 5/0237
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. . . . . by soldering [2021.01]
H01S 5/02375
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. . . . Positioning of the laser chips [2021.01]
H01S 5/0238
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. . . . . using marks [2021.01]
H01S 5/02385
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. . . . . using laser light as reference [2021.01]
H01S 5/0239
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. . . Combinations of electrical or optical elements [2021.01]
H01S 5/024
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. . Arrangements for thermal management [7, 2006.01]
H01S 5/026
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. . Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers (stabilisation of output H01S 5/06) [7, 2006.01]
H01S 5/028
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. . Coatings [7, 2006.01]
H01S 5/04
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Processes or apparatus for excitation, e.g. pumping (H01S 5/06 takes precedence) [7, 2006.01]
H01S 5/042
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. . Electrical excitation [7, 2006.01]
H01S 5/06
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Arrangements for controlling the laser output parameters, e.g. by operating on the active medium [7, 2006.01]
H01S 5/062
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. . by varying the potential of the electrodes (H01S 5/065 takes precedence) [7, 2006.01]
H01S 5/0625
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. . . in multi-section lasers [7, 2006.01]
H01S 5/065
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. . Mode lockingMode suppressionMode selection [7, 2006.01]
H01S 5/068
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. . Stabilisation of laser output parameters (H01S 5/0625 takes precedence) [7, 2006.01]
H01S 5/0683
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. . . by monitoring the optical output parameters [7, 2006.01]
H01S 5/0687
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. . . . Stabilising the frequency of the laser [7, 2006.01]
H01S 5/10
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Construction or shape of the optical resonator [7, 2006.01, 2021.01]
H01S 5/11
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. . Comprising a photonic bandgap structure [2021.01]
H01S 5/12
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. . the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers  (comprising a photonic bandgap structure H01S 5/11;  surface-emitting lasers H01S 5/18) [7, 2006.01, 2021.01]
H01S 5/125
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. . . Distributed Bragg reflector [DBR] lasers [7, 2006.01]
H01S 5/14
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. . External cavity lasers (H01S 5/18 takes precedence; mode locking H01S 5/065) [7, 2006.01]
H01S 5/16
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. . Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface (H01S 5/14 takes precedence) [7, 2006.01]
H01S 5/18
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. . Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities [7, 2006.01, 2021.01]
H01S 5/183
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. . . having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] [7, 2006.01]
H01S 5/185
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. . . having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]  (comprising a photonic bandgap structure H01S 5/11) [2021.01]
H01S 5/187
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. . . . using Bragg reflection [7, 2006.01]
H01S 5/20
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Structure or shape of the semiconductor body to guide the optical wave [7, 2006.01]
H01S 5/22
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. . having a ridge or a stripe structure [7, 2006.01]
H01S 5/223
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. . . Buried stripe structure (H01S 5/227 takes precedence) [7, 2006.01]
H01S 5/227
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. . . Buried mesa structure [7, 2006.01]
H01S 5/24
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. . having a grooved structure, e.g. V-grooved [7, 2006.01]
H01S 5/30
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Structure or shape of the active regionMaterials used for the active region [7, 2006.01]
H01S 5/32
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. . comprising PN junctions, e.g. hetero- or double- hetero-structures (H01S 5/34, H01S 5/36 take precedence) [7, 2006.01]
H01S 5/323
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. . . in AIIIBV compounds, e.g. AlGaAs-laser [7, 2006.01]
H01S 5/327
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. . . in AIIBVI compounds, e.g. ZnCdSe-laser [7, 2006.01]
H01S 5/34
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. . comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers (H01S 5/36 takes precedence) [7, 2006.01]
H01S 5/343
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. . . in AIIIBV compounds, e.g. AlGaAs-laser [7, 2006.01]
H01S 5/347
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. . . in AIIBVI compounds, e.g. ZnCdSe-laser [7, 2006.01]
H01S 5/36
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. . comprising organic materials [2006.01]
H01S 5/40
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Arrangement of two or more semiconductor lasers, not provided for in groups H01S 5/02-H01S 5/30 (H01S 5/50 takes precedence) [7, 2006.01]
H01S 5/42
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. . Arrays of surface emitting lasers [7, 2006.01]
H01S 5/50
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Amplifier structures not provided for in groups H01S 5/02-H01S 5/30 [7, 2006.01]
H01T
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SPARK GAPSOVERVOLTAGE ARRESTERS USING SPARK GAPSSPARKING PLUGSCORONA DEVICESGENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES (overvoltage protection circuits H02H)
H02
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GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
H03
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ELECTRONIC CIRCUITRY
H04
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ELECTRIC COMMUNICATION TECHNIQUE
H05
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ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H10
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SEMICONDUCTOR DEVICESELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR [2023.01]
H99
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SUBJECT MATTER NOT OTHERWISE PROVIDED FOR IN THIS SECTION [2006.01]

Zu vergleichende IPC-Stelle: Es wurden im Verzeichnis noch keine IPC-Stellen für die Vergleichsansicht vorgemerkt. [Version , Sprache ]