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Symbol IPC-Stellen auswählen Titel
A
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HUMAN NECESSITIES
B
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PERFORMING OPERATIONSTRANSPORTING
C
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CHEMISTRYMETALLURGY
D
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TEXTILESPAPER
E
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FIXED CONSTRUCTIONS
F
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MECHANICAL ENGINEERINGLIGHTINGHEATINGWEAPONSBLASTING
G
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PHYSICS
H
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ELECTRICITY
H01
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BASIC ELECTRIC ELEMENTS
H01B
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CABLESCONDUCTORSINSULATORSSELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F 1/00; waveguides H01P)
H01C
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RESISTORS
H01F
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MAGNETSINDUCTANCESTRANSFORMERSSELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES [2]
H01G
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CAPACITORSCAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B 3/00; capacitors with potential-jump or surface barrier H01L 29/00)
H01H
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ELECTRIC SWITCHESRELAYSSELECTORSEMERGENCY PROTECTIVE DEVICES (contact cables H01B 7/10;  electrolytic self-interrupters H01G 9/18;  emergency protective circuit arrangements H02H;  switching by electronic means without contact-making H03K 17/00)
H01J
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ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; arc lamps with consumable electrodes H05B; particle accelerators H05H)
H01K
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ELECTRIC INCANDESCENT LAMPS (details, apparatus or processes for manufacture applicable to both discharge devices and incandescent lamps H01J;  light sources using a combination of incandescent and other types of light generation H01J 61/96, H05B 35/00)
H01L
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SEMICONDUCTOR DEVICESELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR (use of semiconductor devices for measuring G01; resistors in general H01C; magnets, inductors, transformers H01F; capacitors in general H01G; electrolytic devices H01G 9/00; batteries, accumulators H01M; waveguides, resonators, or lines of the waveguide type H01P; line connectors, current collectors H01R; stimulated-emission devices H01S; electromechanical resonators H03H; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R; electric light sources in general H05B; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K; use of semiconductor devices in circuits having a particular application, see the subclass for the application) [2]
H01L 21/00
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Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof [2, 2006.01]
H01L 23/00
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Details of semiconductor or other solid state devices (H01L 25/00 takes precedence) [2, 5, 2006.01]
H01L 25/00
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Assemblies consisting of a plurality of individual semiconductor or other solid state devices (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00; photovoltaic modules or arrays of photovoltaic cells H01L 31/042) [2, 5, 2006.01]
H01L 27/00
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Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (details thereof H01L 23/00, H01L 29/00-H01L 51/00; assemblies consisting of a plurality of individual solid state devices H01L 25/00) [2, 2006.01]
H01L 29/00
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Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrierCapacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layerDetails of semiconductor bodies or of electrodes thereof (H01L 31/00-H01L 47/00, H01L 51/05 take precedence; details other than of semiconductor bodies or of electrodes thereof H01L 23/00; devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2, 6, 2006.01]
H01L 31/00
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Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiationProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereofDetails thereof (H01L 51/42 takes precedence; devices consisting of a plurality of solid state components formed in, or on, a common substrate, other than combinations of radiation-sensitive components with one or more electric light sources, H01L 27/00) [2, 6, 2006.01]
H01L 33/00
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Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emissionProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereofDetails thereof (H01L 51/50 takes precedence; devices consisting of a plurality of semiconductor components formed in or on a common substrate and including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission H01L 27/15; semiconductor lasers H01S 5/00) [2, 2006.01, 2010.01]
H01L 35/00
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Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effectsProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereofDetails thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2, 2006.01]
H01L 37/00
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Thermoelectric devices without a junction of dissimilar materialsThermomagnetic devices, e.g. using Nernst-Ettinghausen effectProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2, 2006.01]
H01L 39/00
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Devices using superconductivity or hyperconductivityProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00; superconductors characterised by the ceramic-forming technique or the ceramic composition C04B 35/00; superconductive or hyperconductive conductors, cables, or transmission lines H01B 12/00; superconductive coils or windings H01F; amplifiers using superconductivity H03F 19/00) [2, 4, 2006.01]
H01L 41/00
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Piezo-electric devices in generalElectrostrictive devices in generalMagnetostrictive devices in generalProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereofDetails thereof (devices consisting of a plurality of solid-state components formed in or on a common substrate H01L 27/00) [2, 2006.01, 2013.01]
H01L 41/02
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Details [2, 2006.01]
H01L 41/04
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. . of piezo-electric or electrostrictive elements [2, 2006.01]
H01L 41/047
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. . . Electrodes [6, 2006.01]
H01L 41/053
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. . . Mounts, supports, enclosures or casings [6, 2006.01]
H01L 41/06
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. . of magnetostrictive elements [2, 2006.01]
H01L 41/08
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Piezo-electric or electrostrictive elements [2, 2006.01]
H01L 41/083
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. . having a stacked or multilayer structure [6, 2006.01]
H01L 41/087
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. . formed as coaxial cables [6, 2006.01]
H01L 41/09
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. . with electrical input and mechanical output [5, 2006.01]
H01L 41/107
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. . with electrical input and electrical output [5, 2006.01]
H01L 41/113
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. . with mechanical input and electrical output [5, 2006.01]
H01L 41/12
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Magnetostrictive elements [2, 2006.01]
H01L 41/16
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Selection of materials [2, 2006.01]
H01L 41/18
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. . for piezo-electric or electrostrictive elements [2, 2006.01]
H01L 41/187
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. . . Ceramic compositions [5, 2006.01]
H01L 41/193
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. . . Macromolecular compositions [5, 2006.01]
H01L 41/20
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. . for magnetostrictive elements [2, 2006.01]
H01L 41/22
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Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof [2, 2006.01, 2013.01]
H01L 41/23
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. . Forming enclosures or casings [2013.01]
H01L 41/25
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. . Assembling devices that include piezo-electric or electrostrictive parts [2013.01]
H01L 41/253
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. . Treating devices or parts thereof to modify a piezo-electric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning [2013.01]
H01L 41/257
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. . . by polarising [2013.01]
H01L 41/27
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. . Manufacturing multilayered piezo-electric or electrostrictive devices or parts thereof, e.g. by stacking piezo-electric bodies and electrodes [2013.01]
H01L 41/273
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. . . by integrally sintering piezo-electric or electrostrictive bodies and electrodes [2013.01]
H01L 41/277
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. . . by stacking bulk piezo-electric or electrostrictive bodies and electrodes [2013.01]
H01L 41/29
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. . Forming electrodes, leads or terminal arrangements [2013.01]
H01L 41/293
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. . . Connection electrodes of multilayered piezo-electric or electrostrictive parts [2013.01]
H01L 41/297
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. . . Individual layer electrodes of multilayered piezo-electric or electrostrictive parts [2013.01]
H01L 41/31
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. . Applying piezo-electric or electrostrictive parts or bodies onto an electrical element or another base [2013.01]
H01L 41/311
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. . . Mounting of piezo-electric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate [2013.01]
H01L 41/312
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. . . by laminating or bonding of piezo-electric or electrostrictive bodies [2013.01]
H01L 41/313
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. . . . by metal fusing or with adhesives [2013.01]
H01L 41/314
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. . . by depositing piezo-electric or electrostrictive layers, e.g. aerosol or screen printing [2013.01]
H01L 41/316
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. . . . by vapour phase deposition [2013.01]
H01L 41/317
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. . . . by liquid phase deposition [2013.01]
H01L 41/318
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. . . . . by sol-gel deposition [2013.01]
H01L 41/319
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. . . . using intermediate layers, e.g. for growth control [2013.01]
H01L 41/33
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. . Shaping or machining of piezo-electric or electrostrictive bodies [2013.01]
H01L 41/331
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. . . by coating or depositing using masks, e.g. lift-off [2013.01]
H01L 41/332
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. . . by etching, e.g. lithography [2013.01]
H01L 41/333
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. . . by moulding or extrusion [2013.01]
H01L 41/335
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. . . by machining [2013.01]
H01L 41/337
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. . . . by polishing or grinding [2013.01]
H01L 41/338
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. . . . by cutting or dicing [2013.01]
H01L 41/339
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. . . . by punching [2013.01]
H01L 41/35
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. . Forming piezo-electric or electrostrictive materials [2013.01]
H01L 41/37
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. . . Composite materials [2013.01]
H01L 41/39
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. . . Inorganic materials [2013.01]
H01L 41/41
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. . . . by melting [2013.01]
H01L 41/43
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. . . . by sintering [2013.01]
H01L 41/45
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. . . Organic materials [2013.01]
H01L 41/47
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Processes or apparatus specially adapted for the assembly, manufacture or treatment of magnetostrictive devices or of parts thereof [2013.01]
H01L 43/00
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Devices using galvano-magnetic or similar magnetic effectsProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2, 2006.01]
H01L 45/00
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Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodesOvshinsky-effect devicesProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00; devices using superconductivity or hyperconductivity H01L 39/00; piezo-electric elements H01L 41/00; bulk negative resistance effect devices H01L 47/00) [2, 2006.01]
H01L 47/00
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Bulk negative resistance effect devices, e.g. Gunn-effect devicesProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2, 2006.01]
H01L 49/00
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Solid state devices not provided for in groups H01L 27/00-H01L 47/00 and H01L 51/00 and not provided for in any other subclassProcesses or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof [2, 2006.01]
H01L 51/00
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Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active partProcesses or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof (devices consisting of a plurality of components formed in or on a common substrate H01L 27/28; thermoelectric devices using organic material H01L 35/00, H01L 37/00; piezo-electric, electrostrictive or magnetostrictive elements using organic material H01L 41/00) [6, 2006.01]
H01M
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PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY [2]
H01P
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WAVEGUIDESRESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
H01Q
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ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B 6/72)
H01R
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ELECTRICALLY-CONDUCTIVE CONNECTIONSSTRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTSCOUPLING DEVICESCURRENT COLLECTORS
H01S
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DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHTDEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
H01T
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SPARK GAPSOVERVOLTAGE ARRESTERS USING SPARK GAPSSPARKING PLUGSCORONA DEVICESGENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES (overvoltage protection circuits H02H)
H02
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GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
H03
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BASIC ELECTRONIC CIRCUITRY
H04
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ELECTRIC COMMUNICATION TECHNIQUE
H05
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ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H99
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SUBJECT MATTER NOT OTHERWISE PROVIDED FOR IN THIS SECTION [2006.01]

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