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IPC-Stelle: H01L 23/552 1-Punkt Untergruppe [Version 2013.01, Sprache EN - English]

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Hierarchielinien

DEKLA-Gruppen

Symbol		Titel
A Hierarchieinformationen		SECTION A — HUMAN NECESSITIES
B Hierarchieinformationen		SECTION B — PERFORMING OPERATIONS; TRANSPORTING
C Hierarchieinformationen		SECTION C — CHEMISTRY; METALLURGY
D Hierarchieinformationen		SECTION D — TEXTILES; PAPER
E Hierarchieinformationen		SECTION E — FIXED CONSTRUCTIONS
F Hierarchieinformationen		SECTION F — MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G Hierarchieinformationen		SECTION G — PHYSICS
H Hierarchieinformationen		SECTION H — ELECTRICITY
H01 Hierarchieinformationen		BASIC ELECTRIC ELEMENTS
H01B Hierarchieinformationen		CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F 1/00; waveguides H01P)
H01C Hierarchieinformationen		RESISTORS
H01F Hierarchieinformationen		MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES [2]
H01G Hierarchieinformationen		CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B 3/00; capacitors with potential-jump or surface barrier H01L 29/00)
H01H Hierarchieinformationen		ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B 7/10; electrolytic self-interrupters H01G 9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K 17/00)
H01J Hierarchieinformationen		ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; arc lamps with consumable electrodes H05B; particle accelerators H05H)
H01K Hierarchieinformationen		ELECTRIC INCANDESCENT LAMPS (details or apparatus or processes for manufacture applicable to both discharge devices and incandescent lamps H01J; light sources using a combination of incandescent and other types of light generation H01J 61/96, H05B 35/00)
H01L Hierarchieinformationen		SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR (use of semiconductor devices for measuring G01; resistors in general H01C; magnets, inductors, transformers H01F; capacitors in general H01G; electrolytic devices H01G 9/00; batteries, accumulators H01M; waveguides, resonators, or lines of the waveguide type H01P; line connectors, current collectors H01R; stimulated-emission devices H01S; electromechanical resonators H03H; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R; electric light sources in general H05B; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K; use of semiconductor devices in circuits having a particular application, see the subclass for the application) [2]
H01L 21/00 Hierarchieinformationen		Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof [2, 2006.01]
H01L 23/00 Hierarchieinformationen		Details of semiconductor or other solid state devices (H01L 25/00 takes precedence) [2, 5]
H01L 23/02 Hierarchieinformationen		. Containers; Seals (H01L 23/12, H01L 23/34, H01L 23/48, H01L 23/552 take precedence) [2, 5]
H01L 23/04 Hierarchieinformationen		. . characterised by the shape [2]
H01L 23/043 Hierarchieinformationen		. . . the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body [5]
H01L 23/045 Hierarchieinformationen		. . . . the other leads having an insulating passage through the base [5]
H01L 23/047 Hierarchieinformationen		. . . . the other leads being parallel to the base [5]
H01L 23/049 Hierarchieinformationen		. . . . the other leads being perpendicular to the base [5]
H01L 23/051 Hierarchieinformationen		. . . . another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type [5]
H01L 23/053 Hierarchieinformationen		. . . the container being a hollow construction and having an insulating base as a mounting for the semiconductor body [5]
H01L 23/055 Hierarchieinformationen		. . . . the leads having a passage through the base [5]
H01L 23/057 Hierarchieinformationen		. . . . the leads being parallel to the base [5]
H01L 23/06 Hierarchieinformationen		. . characterised by the material of the container or its electrical properties [2]
H01L 23/08 Hierarchieinformationen		. . . the material being an electrical insulator, e.g. glass [2]
H01L 23/10 Hierarchieinformationen		. . characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container [2]
H01L 23/12 Hierarchieinformationen		. Mountings, e.g. non-detachable insulating substrates [2]
H01L 23/13 Hierarchieinformationen		. . characterised by the shape [5]
H01L 23/14 Hierarchieinformationen		. . characterised by the material or its electrical properties [2]
H01L 23/15 Hierarchieinformationen		. . . Ceramic or glass substrates [5]
H01L 23/16 Hierarchieinformationen		. Fillings or auxiliary members in containers, e.g. centering rings (H01L 23/42, H01L 23/552 take precedence) [2, 5]
H01L 23/18 Hierarchieinformationen		. . Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device [2]
H01L 23/20 Hierarchieinformationen		. . . gaseous at the normal operating temperature of the device [2]
H01L 23/22 Hierarchieinformationen		. . . liquid at the normal operating temperature of the device [2]
H01L 23/24 Hierarchieinformationen		. . . solid or gel, at the normal operating temperature of the device [2]
H01L 23/26 Hierarchieinformationen		. . . including materials for absorbing or reacting with moisture or other undesired substances [2]
H01L 23/28 Hierarchieinformationen		. Encapsulation, e.g. encapsulating layers, coatings (H01L 23/552 takes precedence) [2, 5]
H01L 23/29 Hierarchieinformationen		. . characterised by the material [5]
H01L 23/31 Hierarchieinformationen		. . characterised by the arrangement [5]
H01L 23/32 Hierarchieinformationen		. Holders for supporting the complete device in operation, i.e. detachable fixtures (H01L 23/40 takes precedence) [2, 5]
H01L 23/34 Hierarchieinformationen		. Arrangements for cooling, heating, ventilating or temperature compensation [2, 5]
H01L 23/36 Hierarchieinformationen		. . Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks [2]
H01L 23/367 Hierarchieinformationen		. . . Cooling facilitated by shape of device [5]
H01L 23/373 Hierarchieinformationen		. . . Cooling facilitated by selection of materials for the device [5]
H01L 23/38 Hierarchieinformationen		. . Cooling arrangements using the Peltier effect [2]
H01L 23/40 Hierarchieinformationen		. . Mountings or securing means for detachable cooling or heating arrangements [2]
H01L 23/42 Hierarchieinformationen		. . Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling [2, 5]
H01L 23/427 Hierarchieinformationen		. . . Cooling by change of state, e.g. use of heat pipes [5]
H01L 23/433 Hierarchieinformationen		. . . Auxiliary members characterised by their shape, e.g. pistons [5]
H01L 23/44 Hierarchieinformationen		. . the complete device being wholly immersed in a fluid other than air (H01L 23/427 takes precedence) [2, 5]
H01L 23/46 Hierarchieinformationen		. . involving the transfer of heat by flowing fluids (H01L 23/42, H01L 23/44 take precedence) [2]
H01L 23/467 Hierarchieinformationen		. . . by flowing gases, e.g. air [5]
H01L 23/473 Hierarchieinformationen		. . . by flowing liquids [5]
H01L 23/48 Hierarchieinformationen		. Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements [2]
H01L 23/482 Hierarchieinformationen		. . consisting of lead-in layers inseparably applied to the semiconductor body [5]
H01L 23/485 Hierarchieinformationen		. . . consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts [5]
H01L 23/488 Hierarchieinformationen		. . consisting of soldered or bonded constructions [5, 2006.01]
H01L 23/49 Hierarchieinformationen		. . . wire-like [5]
H01L 23/492 Hierarchieinformationen		. . . Bases or plates [5]
H01L 23/495 Hierarchieinformationen		. . . Lead-frames [5]
H01L 23/498 Hierarchieinformationen		. . . Leads on insulating substrates [5]
H01L 23/50 Hierarchieinformationen		. . for integrated circuit devices (H01L 23/482-H01L 23/498 take precedence) [2, 5]
H01L 23/52 Hierarchieinformationen		. Arrangements for conducting electric current within the device in operation from one component to another [2]
H01L 23/522 Hierarchieinformationen		. . including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body [5]
H01L 23/525 Hierarchieinformationen		. . . with adaptable interconnections [5]
H01L 23/528 Hierarchieinformationen		. . . Layout of the interconnection structure [5]
H01L 23/532 Hierarchieinformationen		. . . characterised by the materials [5]
H01L 23/535 Hierarchieinformationen		. . including internal interconnections, e.g. cross-under constructions [5]
H01L 23/538 Hierarchieinformationen		. . the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates [5]
H01L 23/544 Hierarchieinformationen		. Marks applied to semiconductor devices, e.g. registration marks, test patterns [5]
H01L 23/552 Hierarchieinformationen		. Protection against radiation, e.g. light [5]
H01L 23/556 Hierarchieinformationen		. . against alpha rays [5]
H01L 23/58 Hierarchieinformationen		. Structural electrical arrangements for semiconductor devices not otherwise provided for [5]
H01L 23/60 Hierarchieinformationen		. . Protection against electrostatic charges or discharges, e.g. Faraday shields [5]
H01L 23/62 Hierarchieinformationen		. . Protection against overcurrent or overload, e.g. fuses, shunts [5]
H01L 23/64 Hierarchieinformationen		. . Impedance arrangements [5]
H01L 23/66 Hierarchieinformationen		. . . High-frequency adaptations [5]
H01L 25/00 Hierarchieinformationen		Assemblies consisting of a plurality of individual semiconductor or other solid state devices (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00; assemblies of photoelectronic cells H01L 31/042) [2, 5]
H01L 27/00 Hierarchieinformationen		Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (details thereof H01L 23/00, H01L 29/00-H01L 51/00; assemblies consisting of a plurality of individual solid state devices H01L 25/00) [2, 2006.01]
H01L 29/00 Hierarchieinformationen		Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (H01L 31/00-H01L 47/00, H01L 51/05 take precedence; details other than of semiconductor bodies or of electrodes thereof H01L 23/00; devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2, 6]
H01L 31/00 Hierarchieinformationen		Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (H01L 51/42 takes precedence; devices consisting of a plurality of solid state components formed in, or on, a common substrate, other than combinations of radiation-sensitive components with one or more electric light sources, H01L 27/00) [2, 6, 2006.01]
H01L 33/00 Hierarchieinformationen		Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (H01L 51/50 takes precedence; devices consisting of a plurality of semiconductor components formed in or on a common substrate and including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission H01L 27/15; semiconductor lasers H01S 5/00) [2, 2006.01, 2010.01]
H01L 35/00 Hierarchieinformationen		Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2]
H01L 37/00 Hierarchieinformationen		Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using Nernst-Ettinghausen effect; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2]
H01L 39/00 Hierarchieinformationen		Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00; superconductors characterised by the ceramic-forming technique or the ceramic composition C04B 35/00; superconductive or hyperconductive conductors, cables, or transmission lines H01B 12/00; superconductive coils or windings H01F; amplifiers using superconductivity H03F 19/00) [2, 4]
H01L 41/00 Hierarchieinformationen		Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (devices consisting of a plurality of solid-state components formed in or on a common substrate H01L 27/00) [2, 2013.01]
H01L 43/00 Hierarchieinformationen		Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2]
H01L 45/00 Hierarchieinformationen		Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00; devices using superconductivity or hyperconductivity H01L 39/00; piezo-electric elements H01L 41/00; bulk negative resistance effect devices H01L 47/00) [2]
H01L 47/00 Hierarchieinformationen		Bulk negative resistance effect devices, e.g. Gunn-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (devices consisting of a plurality of solid state components formed in or on a common substrate H01L 27/00) [2]
H01L 49/00 Hierarchieinformationen		Solid state devices not provided for in groups H01L 27/00-H01L 47/00 and H01L 51/00 and not provided for in any other subclass; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof [2, 2006.01]
H01L 51/00 Hierarchieinformationen		Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof (devices consisting of a plurality of components formed in or on a common substrate H01L 27/28; thermoelectric devices using organic material H01L 35/00, H01L 37/00; piezo-electric, electrostrictive or magnetostrictive elements using organic material H01L 41/00) [6, 2006.01]
H01M Hierarchieinformationen		PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY (electrochemical processes or apparatus in general C25; semiconductor or other solid state devices for converting light or heat into electrical energy H01L, e.g. H01L 31/00, H01L 35/00, H01L 37/00) [2]
H01P Hierarchieinformationen		WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
H01Q Hierarchieinformationen		AERIALS (microwave radiators for near-field therapeutic treatment A61N 5/04; apparatus for testing aerials or for measuring aerial characteristics G01R; waveguides H01P; radiators or aerials for microwave heating H05B 6/72)
H01R Hierarchieinformationen		ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS (switches, fuses H01H; coupling devices of the waveguide type H01P 5/00; switching arrangements for the supply or distribution of electric power H02B; installations of electric cables or lines, or of combined optical and electric cables or lines, or of auxiliary apparatus H02G; printed means for providing electric connections to or between printed circuits H05K)
H01S Hierarchieinformationen		DEVICES USING STIMULATED EMISSION
H01T Hierarchieinformationen		SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES (working of metal by the action of a high concentration of electric current B23H; welding, e.g. arc welding, electron beam welding or electrolytic welding, B23K; gas-filled discharge tubes with solid cathode H01J 17/00; electric arc lamps H05B 31/00)
H02 Hierarchieinformationen		GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
H03 Hierarchieinformationen		BASIC ELECTRONIC CIRCUITRY
H04 Hierarchieinformationen		ELECTRIC COMMUNICATION TECHNIQUE
H05 Hierarchieinformationen		ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H99 Hierarchieinformationen		SUBJECT MATTER NOT OTHERWISE PROVIDED FOR IN THIS SECTION [2006.01]

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