Internationale Patentklassifikation

Recherche
Merkliste

IPC-Version

Sprache

Anzeigesprachen

Recherche-Kriterium

Symbol	Version, Sprache	Auswahl

Suche in DEPATISnet Suche in DPMAregister

Suchanfrage: Es wurde noch keine Recherche ausgeführt.

IPC-Stelle: H01C 1/032 2-Punkt Untergruppe [Version 2024.01 (aktuell), Sprache EN - English]

Anzeigeoptionen

Definitionen

Anmerkungen

Sachverzeichnisse

Stich- und Schlagworte

Hierarchielinien

DEKLA-Gruppen

Symbol		Titel
A Hierarchieinformationen		HUMAN NECESSITIES
B Hierarchieinformationen		PERFORMING OPERATIONS; TRANSPORTING
C Hierarchieinformationen		CHEMISTRY; METALLURGY
D Hierarchieinformationen		TEXTILES; PAPER
E Hierarchieinformationen		FIXED CONSTRUCTIONS
F Hierarchieinformationen		MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G Hierarchieinformationen		PHYSICS
H Hierarchieinformationen		ELECTRICITY
H01 Hierarchieinformationen		ELECTRIC ELEMENTS
H01B Hierarchieinformationen		CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F 1/00; waveguides H01P)
H01C Hierarchieinformationen		RESISTORS
H01C 1/00 Hierarchieinformationen		Details [1, 2006.01]
H01C 1/01 Hierarchieinformationen		. Mounting; Supporting [2, 2006.01]
H01C 1/012 Hierarchieinformationen		. . the base extending along, and imparting rigidity or reinforcement to, the resistive element (H01C 1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical, or toroidal winding H01C 3/18, H01C 3/20; the resistive element being formed as one or more layers or coatings on a base H01C 7/00) [2, 2006.01]
H01C 1/014 Hierarchieinformationen		. . the resistor being suspended between, and being supported by, two supporting sections (H01C 1/016 takes precedence) [2, 2006.01]
H01C 1/016 Hierarchieinformationen		. . with compensation for resistor expansion or contraction [2, 2006.01]
H01C 1/02 Hierarchieinformationen		. Housing; Enclosing; Embedding; Filling the housing or enclosure [1, 2, 2006.01]
H01C 1/022 Hierarchieinformationen		. . the housing or enclosure being openable or separable from the resistive element [2, 2006.01]
H01C 1/024 Hierarchieinformationen		. . the housing or enclosure being hermetically sealed (H01C 1/028, H01C 1/032, H01C 1/034 take precedence) [2, 2006.01]
H01C 1/026 Hierarchieinformationen		. . . with gaseous or vacuum spacing between the resistive element and the housing or casing [2, 2006.01]
H01C 1/028 Hierarchieinformationen		. . the resistive element being embedded in insulation with outer enclosing sheath [2, 2006.01]
H01C 1/03 Hierarchieinformationen		. . . with powdered insulation [2, 2006.01]
H01C 1/032 Hierarchieinformationen		. . plural layers surrounding the resistive element (H01C 1/028 takes precedence) [2, 2006.01]
H01C 1/034 Hierarchieinformationen		. . the housing or enclosure being formed as coating or mould without outer sheath (H01C 1/032 takes precedence) [2, 2006.01]
H01C 1/036 Hierarchieinformationen		. . . on wound resistive element [2, 2006.01]
H01C 1/04 Hierarchieinformationen		. Arrangements of distinguishing marks, e.g. colour coding [1, 2006.01]
H01C 1/06 Hierarchieinformationen		. Electrostatic or electromagnetic shielding arrangements [1, 2006.01]
H01C 1/08 Hierarchieinformationen		. Cooling, heating or ventilating arrangements [1, 2006.01]
H01C 1/082 Hierarchieinformationen		. . using forced fluid flow [2, 2006.01]
H01C 1/084 Hierarchieinformationen		. . using self-cooling, e.g. fins, heat sinks [2, 2006.01]
H01C 1/12 Hierarchieinformationen		. Arrangements of current collectors [1, 2006.01]
H01C 1/125 Hierarchieinformationen		. . of fluid contacts [2, 2006.01]
H01C 1/14 Hierarchieinformationen		. Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors [1, 2006.01]
H01C 1/142 Hierarchieinformationen		. . the terminals or tapping points being coated on the resistive element [2, 2006.01]
H01C 1/144 Hierarchieinformationen		. . the terminals or tapping points being welded or soldered [2, 2006.01]
H01C 1/146 Hierarchieinformationen		. . the resistive element surrounding the terminal [2, 2006.01]
H01C 1/148 Hierarchieinformationen		. . the terminals embracing or surrounding the resistive element (H01C 1/142 takes precedence) [2, 2006.01]
H01C 1/16 Hierarchieinformationen		. Resistor networks not otherwise provided for [1, 2006.01]
H01C 3/00 Hierarchieinformationen		Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven, or formed as grids [1, 2006.01]
H01C 7/00 Hierarchieinformationen		Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C 8/00; resistors having potential barriers, e.g. field-effect resistors, H01L 29/00; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H01L 31/00; magnetic field controlled resistors H10N 50/10; bulk negative resistance effect devices H10N 80/00) [1, 2, 2006.01]
H01C 8/00 Hierarchieinformationen		Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material [2, 2006.01]
H01C 10/00 Hierarchieinformationen		Adjustable resistors [2, 2006.01]
H01C 11/00 Hierarchieinformationen		Non-adjustable liquid resistors [1, 2, 2006.01]
H01C 13/00 Hierarchieinformationen		Resistors not provided for elsewhere [1, 2006.01]
H01C 17/00 Hierarchieinformationen		Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C 1/02; reducing insulation surrounding a resistor to powder H01C 1/03; manufacture of thermally variable resistors H01C 7/02, H01C 7/04) [1, 2, 2006.01]
H01F Hierarchieinformationen		MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES [2]
H01G Hierarchieinformationen		CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B 3/00; capacitors having potential barriers H01L 29/00)
H01H Hierarchieinformationen		ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B 7/10; electrolytic self-interrupters H01G 9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K 17/00)
H01J Hierarchieinformationen		ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; arc lamps with consumable electrodes H05B; particle accelerators H05H)
H01K Hierarchieinformationen		ELECTRIC INCANDESCENT LAMPS (details, apparatus or processes for manufacture applicable to both discharge devices and incandescent lamps H01J; light sources using a combination of incandescent and other types of light generation H01J 61/96, H05B 35/00)
H01L Hierarchieinformationen		SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10 (use of semiconductor devices for measuring G01; resistors in general H01C; magnets, inductors or transformers H01F; capacitors in general H01G; electrolytic devices H01G 9/00; batteries or accumulators H01M; waveguides, resonators or lines of the waveguide type H01P; line connectors or current collectors H01R; stimulated-emission devices H01S; electromechanical resonators H03H; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R; electric light sources in general H05B; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components H05K; use of semiconductor devices in circuits having a particular application, see the subclass for the application) [2]
H01M Hierarchieinformationen		PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY [2]
H01P Hierarchieinformationen		WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
H01Q Hierarchieinformationen		ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B 6/72)
H01R Hierarchieinformationen		ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
H01S Hierarchieinformationen		DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
H01T Hierarchieinformationen		SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES (overvoltage protection circuits H02H)
H02 Hierarchieinformationen		GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
H03 Hierarchieinformationen		ELECTRONIC CIRCUITRY
H04 Hierarchieinformationen		ELECTRIC COMMUNICATION TECHNIQUE
H05 Hierarchieinformationen		ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H10 Hierarchieinformationen		SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR [2023.01]
H99 Hierarchieinformationen		SUBJECT MATTER NOT OTHERWISE PROVIDED FOR IN THIS SECTION [2006.01]

Zu vergleichende IPC-Stelle: Es wurden im Verzeichnis noch keine IPC-Stellen für die Vergleichsansicht vorgemerkt. [Version , Sprache ]