| 54 |
Title |
TI |
[EN] SAW DEVICE WITH SUPPRESSED PARASITIC SIGNAL
[FR] DISPOSITIF À ONDES ACOUSTIQUES DE SURFACE À SIGNAL PARASITE SUPPRIMÉ |
| 71/73 |
Applicant/owner |
PA |
RF360 EUROPE GMBH, DE
|
| 72 |
Inventor |
IN |
MAYER ANDREAS, DE
;
MAYER ELENA, DE
;
MAYER MARKUS, DE
;
RUILE WERNER, DE
|
| 22/96 |
Application date |
AD |
Apr 19, 2018 |
| 21 |
Application number |
AN |
2018060085 |
|
Country of application |
AC |
EP |
|
Publication date |
PUB |
Nov 15, 2018 |
33
31
32 |
Priority data |
PRC
PRN
PRD |
DE
102017110233
20170511
|
| 51 |
IPC main class |
ICM |
H03H 9/02
(2006.01)
|
| 51 |
IPC secondary class |
ICS |
H03H 9/64
(2006.01)
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
H03H 9/02818
H03H 9/02866
H03H 9/6433
H03H 9/6489
|
|
MCD main class |
MCM |
H03H 9/02
(2006.01)
|
|
MCD secondary class |
MCS |
H03H 9/64
(2006.01)
|
|
MCD additional class |
MCA |
|
| 57 |
Abstract |
AB |
[EN] In a SAW device comprises a SAW chip bearing a SAW transducer arranged within a first signal line parasitic signals due to higher harmonics of the operating frequency of the SAW devices are electrically eliminated by compensating means comprising at least one second signal line having means for producing a cancelling signal different in sign or phase to the parasitic signal, or a shunt line to electrically connect the SAW transducer to a back side metallization of the SAW chip.
[FR] Dans un dispositif à ondes acoustiques de surface qui comprend une puce à ondes acoustiques de surface portant un transducteur à ondes acoustiques de surface agencé à l'intérieur d'un premier circuit de transmission, des signaux parasites dus à des harmoniques supérieures de la fréquence de fonctionnement des dispositifs à ondes acoustiques de un moyen de compensation comprenant au moins un second circuit de transmission ayant un moyen de production d'un signal d'annulation différent en termes de signe ou de phase par rapport au signal parasite, ou une ligne de dérivation pour connecter électriquement le transducteur à ondes acoustiques de surface à une métallisation côté arrière de la puce à ondes acoustiques de surface. |
| 56 |
Cited documents identified in the search |
CT |
EP000002590326A2
EP000002963819A1
JP000S62261211A
US020130169378A1
US020160118956A1
|
| 56 |
Cited documents indicated by the applicant |
CT |
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
MASAFUMI IWAKI ET AL: "An attenuation improvement technology for ladder SAW/FBAR filters and duplexers employing cancellation circuit", MICROWAVE CONFERENCE (EUMC), 2011 41ST EUROPEAN, IEEE, 10 October 2011 (2011-10-10), pages 751 - 754, XP032072782, ISBN: 978-1-61284-235-6 7
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
H03H 9/02
H03H 9/64
|
