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Dokument US000012266694B2 (Seiten: 22)

Bibliografische Daten Dokument US000012266694B2 (Seiten: 22)
INID Kriterium Feld Inhalt
54 Titel TI [EN] Silicon carbide device with a stripe-shaped trench gate structure
71/73 Anmelder/Inhaber PA INFINEON TECHNOLOGIES AG, DE
72 Erfinder IN BASLER THOMAS, DE ; ELLINGHAUS PAUL, DE ; ELPELT RUDOLF, DE ; HELL MICHAEL, DE ; KONRATH JENS PETER, AT ; LEENDERTZ CASPAR, DE ; NIU SHIQIN, DE ; PETERS DETHARD, DE ; SCHRAML KONRAD, DE ; ZIPPELIUS BERND LEONHARD, DE
22/96 Anmeldedatum AD 28.12.2023
21 Anmeldenummer AN 202318398823
Anmeldeland AC US
Veröffentlichungsdatum PUB 01.04.2025
33
31
32
Priorität PRC
PRN
PRD
DE
102019121859
14.08.2019
33
31
32
PRC
PRN
PRD
US
202016986338
06.08.2020
33
31
32
PRC
PRN
PRD
US
202218073860
02.12.2022
51 IPC-Hauptklasse ICM
51 IPC-Nebenklasse ICS
IPC-Zusatzklasse ICA
IPC-Indexklasse ICI
Gemeinsame Patentklassifikation CPC H10D 12/031
H10D 12/481
H10D 30/60
H10D 30/668
H10D 30/669
H10D 62/10
H10D 62/106
H10D 62/107
H10D 62/127
H10D 62/393
H10D 62/8325
H10D 62/8503
H10D 64/513
H10D 64/519
H10D 64/66
Y02B 70/10
MCD-Hauptklasse MCM
MCD-Nebenklasse MCS
MCD-Zusatzklasse MCA
57 Zusammenfassung AB [EN] A silicon carbide device includes: a transistor cell having a stripe-shaped trench gate structure extending from a first surface into a silicon carbide body, the gate structure having a gate length along a lateral first direction, a bottom surface and a first gate sidewall of the gate structure being connected via a first bottom edge of the gate structure; at least one source region of a first conductivity type in contact with the first gate sidewall; and a shielding region of a second conductivity type in contact with the first bottom edge of the gate structure across at least 20% of the gate length. No source regions of the first conductivity type are in contact with a second gate sidewall of the gate structure.
56 Entgegengehaltene Patentdokumente/Zitate,
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56 Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt
CTNP
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt
CTNP
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Sequenzprotokoll
Prüfstoff-IPC ICP H10D 48/00