| 54 |
Titel |
TI |
[EN] Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor |
| 71/73 |
Anmelder/Inhaber |
PA |
INFINEON TECHNOLOGIES AUSTRIA AG, AT
|
| 72 |
Erfinder |
IN |
BAEUMLER CHRISTIAN, DE
;
BASLER THOMAS, DE
;
FÜRGUT EDWARD, DE
;
LIU XING, DE
;
SCHMOELZER BERND, AT
;
SCHOLZ WOLFGANG, DE
|
| 22/96 |
Anmeldedatum |
AD |
30.06.2023 |
| 21 |
Anmeldenummer |
AN |
202318217044 |
|
Anmeldeland |
AC |
US |
|
Veröffentlichungsdatum |
PUB |
11.01.2024 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
EP
22183358
20220706
|
| 51 |
IPC-Hauptklasse |
ICM |
H01L 23/495
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
H01L 23/00
(2006.01)
H05K 1/02
(2006.01)
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
H01L 2224/04105
H01L 2224/0603
H01L 2224/48245
H01L 2224/48247
H01L 2224/4903
H01L 2224/49111
H01L 2224/4917
H01L 2224/49175
H01L 2224/73267
H01L 23/488
H01L 23/4952
H01L 23/49541
H01L 23/49562
H01L 23/49586
H01L 24/06
H01L 24/48
H01L 24/49
H01L 29/41708
H01L 29/7393
H01L 2924/15153
H01L 2924/1815
H01L 2924/30107
H03K 17/04106
H03K 17/687
H05K 1/0213
H05K 1/0216
H05K 1/18
H05K 2201/10166
H05K 2201/10189
|
|
MCD-Hauptklasse |
MCM |
H01L 23/495
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
H01L 23/00
(2006.01)
H05K 1/02
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] A semiconductor package comprises a semiconductor transistor circuit comprising a semiconductor transistor die comprising die terminals, including a collector/drain, a source/emitter, a sense source/sense emitter, a gate, and a load path, a driver line connected with the gate, and a gate control loop in which the a sense source/sense emitter is connected with the driver line, a plurality of external contacts comprising at least one first external contact connected with the drain/collector, at least one second external contact connected with the source/emitter, a third external contact connected with the a sense source/sense emitter, and a fourth external contact connected with the gate, wherein the plurality of external contacts are arranged or configured to reduce or utilize the magnetic coupling induced by a load current flowing through the load path. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
H01L 23/00
|
