| 54 |
Titel |
TI |
[EN] POLYMER LAYER SYSTEM PRESSURE SENSOR DEVICE, AND POLYMER LAYER SYSTEM PRESSURE SENSOR METHOD |
| 71/73 |
Anmelder/Inhaber |
PA |
BOSCH GMBH ROBERT, DE
;
BRETTSCHNEIDER THOMAS, DE
;
DORRER CHRISTIAN, DE
|
| 72 |
Erfinder |
IN |
BRETTSCHNEIDER THOMAS, DE
;
DORRER CHRISTIAN, DE
|
| 22/96 |
Anmeldedatum |
AD |
03.07.2012 |
| 21 |
Anmeldenummer |
AN |
201214239802 |
|
Anmeldeland |
AC |
US |
|
Veröffentlichungsdatum |
PUB |
02.10.2014 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
DE
102011081887
31.08.2011
|
33
31
32 |
PRC
PRN
PRD |
EP
2012062874
03.07.2012
|
| 51 |
IPC-Hauptklasse |
ICM |
G01L 7/00
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
B01L 2200/146
B01L 2300/0663
B01L 3/502707
G01L 7/00
G01L 9/0045
G01L 9/0052
G01L 9/0072
|
|
MCD-Hauptklasse |
MCM |
G01L 7/00
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] A polymer layer system pressure sensor device includes a first polymer substrate having a first cavity and a first polymer membrane stretched over the first cavity. The first polymer membrane is configured to be deflected dependent on a pressure in the first cavity. The device further includes a first membrane metallization layer applied to the first polymer membrane above the first cavity. The first membrane metallization layer is configured to be deflected together with the first polymer membrane dependent on the pressure in the first cavity. The device further includes a second polymer substrate, arranged over the first polymer membrane, a second cavity, arranged over the first cavity, and a second polymer membrane, stretched over the second cavity. The device further includes a second membrane metallization layer applied to the second polymer membrane within the second cavity and includes a third polymer substrate arranged over the second polymer membrane. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
US000004227419A
US000004426673A
US000004542435A
US000004586109A
US000004701826A
US000004716492A
US000004730496A
US000004773972A
US000004831492A
US000004862317A
US000004864463A
US000004991283A
US000005050035A
US000005171132A
US000005186054A
US000005189591A
US000005189916A
US000005211058A
US000005349492A
US000005486976A
US000005499158A
US000005525280A
US000005528452A
US000005756899A
US000005792957A
US000005920015A
US000006111520A
US000006252759B1
US000006278379B1
US000006387318B1
US000006460416B1
US000006615665B1
US000006667725B1
US000006715356B2
US000006848318B2
US000006874367B2
US000006929974B2
US000007107855B2
US000007135749B2
US000007152479B2
US000007246526B2
US000007254008B2
US000007316163B2
US000007353711B2
US000007514000B2
US000007607641B1
US000007624643B2
US000007662653B2
US000007677107B2
US000007796371B2
US000008256299B2
US000008313468B2
US000008388908B2
US000008471346B2
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
B01L 3/00
G01L 7/00
G01L 9/00
|
