| 54 |
Titel |
TI |
[EN] MICROMECHANICAL SENSOR HAVING A BANDPASS CHARACTERISTIC |
| 71/73 |
Anmelder/Inhaber |
PA |
DIENEL MARCO, DE
;
MEHNER JAN, DE
;
SORGER ALEXANDER, DE
;
UNIV CHEMNITZ TECH, DE
|
| 72 |
Erfinder |
IN |
DIENEL MARCO, DE
;
MEHNER JAN, DE
;
SORGER ALEXANDER, DE
|
| 22/96 |
Anmeldedatum |
AD |
25.08.2011 |
| 21 |
Anmeldenummer |
AN |
201113217639 |
|
Anmeldeland |
AC |
US |
|
Veröffentlichungsdatum |
PUB |
01.03.2012 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
EP
10401151
20100826
|
| 51 |
IPC-Hauptklasse |
ICM |
G01H 1/00
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
G01H 13/00
|
|
MCD-Hauptklasse |
MCM |
G01H 1/00
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] The invention relates to a micromechanical sensor having at least two spring-mass damper oscillators. The micromechanical sensor has a first spring-mass-damper oscillating system with a first resonant frequency and a second spring-mass-damper oscillating system with a second resonant frequency which is lower than the first resonant frequency. The invention also relates to a method for detection and/or measurement of oscillations by means of a sensor such as this, and to a method for production of a micromechanical sensor such as this. The first and the second spring-mass-damper oscillating systems have electrodes which oscillate in a measurement direction about electrode rest positions with electrode deflections which are equal to or proportional to deflections of the spring-mass-damper oscillators. The systems are coupled to one another by means of at least one electrostatic field, which acts on the electrodes, forming at least one capacitance with the capacitance being governed by at least one electrode area and by at least one electrode separation and/or an electrode coverage. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
US000002906117A
US000005775472A
US000006487864B1
US020030200807A1
US020040123661A1
US020070214890A1
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
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Prüfstoff-IPC |
ICP |
G01H 1/00
|
