| 54 |
Title |
TI |
[EN] Integrated semiconductor circuit having a logic and power metallization without intermetal dielectric |
| 71/73 |
Applicant/owner |
PA |
DETZEL THOMAS
;
RUEB MICHAEL
|
| 72 |
Inventor |
IN |
DETZEL THOMAS, AT
;
RUEB MICHAEL, AT
|
| 22/96 |
Application date |
AD |
Jan 18, 2005 |
| 21 |
Application number |
AN |
3727305 |
|
Country of application |
AC |
US |
|
Publication date |
PUB |
Aug 18, 2005 |
33
31
32 |
Priority data |
PRC
PRN
PRD |
DE
102004003538
20040123
|
| 51 |
IPC main class |
ICM |
H01L 21/336
|
| 51 |
IPC secondary class |
ICS |
H01L 31/113
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
H01L 23/528
H01L 23/5283
H01L 2924/0002
H10D 30/64
H10D 30/66
H10D 62/83
H10D 64/252
H10D 64/257
H10D 64/62
|
|
MCD main class |
MCM |
|
|
MCD secondary class |
MCS |
H01L 21/336
(2006.01)
H01L 21/768
(2006.01)
H01L 23/522
(2006.01)
H01L 23/528
(2006.01)
H01L 31/113
(2006.01)
|
|
MCD additional class |
MCA |
H01L 29/417
(2006.01)
H01L 29/45
(2006.01)
H01L 29/78
(2006.01)
|
| 57 |
Abstract |
AB |
[EN] An integrated semiconductor circuit having a first and a second portion of a substrate, in which a power semiconductor circuit structure and a logic circuit structure are respectively formed. The metallization having a power metal layer and an in relative terms thinner logic metal layer, the two metal layers being located directly above one another in this order, without an intermetal dielectric between them, only in the first portion above the power semiconductor circuit structure, and an uninterrupted conductive barrier layer being located at least between the power metal layer and the intermediate oxide layer and also between the power metal layer and the contact regions and electrode portions of the power semiconductor circuit structure which it contact-connects, and to a method for fabricating it. |
| 56 |
Cited documents identified in the search |
CT |
US000004718977A
US000004807007A
US000006020640A
US020010018257A1
|
| 56 |
Cited documents indicated by the applicant |
CT |
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
H01L 23/528
H01L 31/113
|
