| 54 |
Titel |
TI |
[EN] Power electronics unit comprising a circuit board and a power module, method for producing a power electronics unit, motor vehicle comprising a power electronics unit |
| 71/73 |
Anmelder/Inhaber |
PA |
AUDI AG, DE
|
| 72 |
Erfinder |
IN |
APELSMEIER ANDREAS, DE
;
RUPPERT DANIEL, DE
;
SÖHNLE BENJAMIN, DE
|
| 22/96 |
Anmeldedatum |
AD |
07.09.2020 |
| 21 |
Anmeldenummer |
AN |
202017623378 |
|
Anmeldeland |
AC |
US |
|
Veröffentlichungsdatum |
PUB |
21.05.2024 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
DE
102019125108
18.09.2019
|
33
31
32 |
PRC
PRN
PRD |
EP
2020074923
07.09.2020
|
| 51 |
IPC-Hauptklasse |
ICM |
H01R 12/58
(2011.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
H01R 12/52
(2011.01)
H05K 1/18
(2006.01)
H05K 3/30
(2006.01)
|
|
IPC-Zusatzklasse |
ICA |
H01R 12/57
(2011.01)
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
H01L 23/498
H01L 25/072
H01R 12/52
H01R 12/57
H01R 12/58
H01R 12/7076
H01R 12/718
H05K 1/144
H05K 1/18
H05K 2201/042
H05K 2201/10015
H05K 2201/10166
H05K 2201/10303
H05K 2201/10318
H05K 2201/10378
H05K 2201/10401
H05K 2201/1059
H05K 3/284
H05K 3/308
|
|
MCD-Hauptklasse |
MCM |
H01R 12/58
(2011.01)
|
|
MCD-Nebenklasse |
MCS |
H01R 12/52
(2011.01)
H05K 1/18
(2006.01)
H05K 3/30
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
H01R 12/57
(2011.01)
|
| 57 |
Zusammenfassung |
AB |
[EN] Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
DE102009055648A1
US000011756868B2
US020100127383A1
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
CN000107403793A
DE000010024377A1
DE102007029678A1
DE102017207382A1
DE102017212739A1
EP000001906717A2
EP000002765840A2
EP000003404774A1
US000007294007B1
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
International Preliminary Report on Patentability with English translation issued on Mar. 15, 2022, in corresponding International Application No. PCT/EP2020/074923; 22 pages. 1;
International Search Report (with English Translation) issued on Feb. 5, 2021 in corresponding International Patent Application No. PCT/EP2020/074923; 8 pages. 1;
Office Action issued on Feb. 29, 2024, in corresponding Chinese Application No. 202080065046.5, 14 pages. 1
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
H01R 12/52
H01R 12/57
H01R 12/58
|
