| 54 |
Titel |
TI |
[EN] Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure |
| 71/73 |
Anmelder/Inhaber |
PA |
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG, AT
|
| 72 |
Erfinder |
IN |
ANDERSON STEVE, AT
;
GAVAGNIN MARCO, AT
;
LEITGEB MARKUS, AT
;
SCHREMS MARTIN, AT
;
WINKLER ROLAND, AT
|
| 22/96 |
Anmeldedatum |
AD |
09.11.2018 |
| 21 |
Anmeldenummer |
AN |
201816185283 |
|
Anmeldeland |
AC |
US |
|
Veröffentlichungsdatum |
PUB |
29.09.2020 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
EP
17201225
20171111
|
| 51 |
IPC-Hauptklasse |
ICM |
H01L 23/538
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
H01L 21/48
(2006.01)
H01L 21/56
(2006.01)
H01L 21/66
(2006.01)
H01L 21/683
(2006.01)
H01L 23/00
(2006.01)
H01L 23/13
(2006.01)
H01L 23/367
(2006.01)
H01L 23/498
(2006.01)
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
H01L 21/4853
H01L 21/486
H01L 21/561
H01L 21/6835
H01L 22/12
H01L 22/14
H01L 22/20
H01L 2221/68345
H01L 2221/68359
H01L 2224/95001
H01L 23/13
H01L 23/367
H01L 23/49811
H01L 23/5384
H01L 23/5386
H01L 23/5389
H01L 24/97
|
|
MCD-Hauptklasse |
MCM |
H01L 23/538
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
H01L 21/48
(2006.01)
H01L 21/56
(2006.01)
H01L 21/66
(2006.01)
H01L 21/683
(2006.01)
H01L 23/00
(2006.01)
H01L 23/13
(2006.01)
H01L 23/367
(2006.01)
H01L 23/498
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
US020080117607A1
US020090267171A1
US020150008566A1
US020150262928A1
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
EP000001734581A1
US000007727802B2
US000008431438B2
US000009338891B2
US000009443839B2
US000009516740B2
US020090309212A1
US020110018123A1
US020130147041A1
US020130249101A1
US020160044789A1
US020160086894A1
US020160118332A1
US020160118333A1
US020160219712A1
US020160316566A1
US020160322295A1
WO002017046762A1
WO002017046764A1
WO002017046765A1
WO002017093907A1
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
H01L 21/56
H01L 21/66
H01L 21/683
H01L 23/00
H01L 23/13
H01L 23/367
H01L 23/498
H01L 23/538
|
