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Document US000009590136B2 (Pages: 62)

Bibliographic data Document US000009590136B2 (Pages: 62)
INID Criterion Field Contents
54 Title TI [EN] Semiconductor device for optoelectronic integrated circuits
71/73 Applicant/owner PA OPEL SOLAR INC, US ; UNIV CONNECTICUT, US
72 Inventor IN TAYLOR GEOFF W, US
22/96 Application date AD Jun 11, 2015
21 Application number AN 201514736624
Country of application AC US
Publication date PUB Mar 7, 2017
33
31
32
Priority data PRC
PRN
PRD


51 IPC main class ICM H01L 29/06 (2006.01)
51 IPC secondary class ICS H01L 21/02 (2006.01)
H01L 21/70 (2006.01)
H01L 31/102 (2006.01)
H01L 33/00 (2010.01)
H01L 33/02 (2010.01)
H01L 33/04 (2010.01)
IPC additional class ICA
IPC index class ICI
Cooperative patent classification CPC H01S 5/06203
H01S 5/183
H01S 5/3086
H01S 5/343
H10D 30/4732
H10D 62/116
H10D 62/149
H10D 62/357
H10D 62/85
H10D 64/62
H10H 20/013
H10H 20/0137
H10H 20/062
H10H 20/811
H10H 20/812
H10H 20/814
H10H 20/8215
H10H 20/824
MCD main class MCM H01L 29/06 (2006.01)
MCD secondary class MCS H01L 21/02 (2006.01)
H01L 21/70 (2006.01)
H01L 31/102 (2006.01)
H01L 33/00 (2010.01)
H01L 33/02 (2010.01)
H01L 33/04 (2010.01)
MCD additional class MCA
57 Abstract AB [EN] A semiconductor device includes a series of layers formed on a substrate, including a first plurality of n-type layers, a second plurality of layers that form a p-type modulation doped quantum well structure (MDQWS), a third plurality of layers disposed between the p-type MDQWS and a fourth plurality of layers that form an n-type MDQWS, and a fifth plurality of p-type layers. The first plurality of layers includes a first etch stop layer of n-type formed on an n-type contact layer. The third plurality of layers includes a second etch stop layer formed above the p-type MDQWS and a third etch stop layer formed above and offset from the second etch stop layer. The fifth plurality of layers includes a fourth etch stop layer of p-type formed above the n-type MDQWS and a fifth etch stop layer of p-type doping formed above and offset from the fourth etch stop layer.
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56 Cited non-patent literature identified in the search CTNP
56 Cited non-patent literature indicated by the applicant CTNP "Development of Refractory Ohmic Contact Materials for Gallium Arsenide Compound Semiconductors", Masanori Murakami, Science and Technology of Advanced Materials 3 (2002) pp. 1-27. 1;
"InXGa1-XAs Ohmic Contacts to n-Type GaAs with a Tungsten Nitride Barrier", Chihiro J. Uchibori et al., Journal of Electronic Materials, vol. 26, No. 4, 1997. 1;
Selective RIE in BC13/SF6 Plasmas for GaAs Hemt Gate Recess Etching, Y.S. Lee et al., Department of Chemical and Petroleum Engineering, University of Kansas, 2000. 1;
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U.S. Appl. No. 14/222,841, filed Mar. 24, 2014, Geoff W. Taylor. 1;
U.S. Appl. No. 60/376,238, filed Apr. 26, 2002, Geoff W. Taylor. 1
Citing documents Determine documents
Sequence listings
Search file IPC ICP H01L 21/02
H01L 21/70
H01L 29/06
H01L 29/08
H01L 29/10
H01L 29/45
H01L 29/778
H01L 33/00
H01L 33/10