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Dokument US000009504554B2 (Seiten: 16)

Bibliografische Daten Dokument US000009504554B2 (Seiten: 16)
INID Kriterium Feld Inhalt
54 Titel TI [EN] Microstructured absorbable implant
71/73 Anmelder/Inhaber PA BIOTRONIK AG, CH
72 Erfinder IN ANOPUO OKECHUKWU, DE ; BADENDIECK MONIKA, DE ; BAYER ULLRICH, DE ; DROBEK THOMAS, DE ; PETERS SUSANNE, DE
22/96 Anmeldedatum AD 02.01.2014
21 Anmeldenummer AN 201414146550
Anmeldeland AC US
Veröffentlichungsdatum PUB 29.11.2016
33
31
32
Priorität PRC
PRN
PRD
US
201361752992
20130116
51 IPC-Hauptklasse ICM C25F 3/04 (2006.01)
51 IPC-Nebenklasse ICS A61F 2/06 (2006.01)
A61L 31/02 (2006.01)
A61L 31/14 (2006.01)
C22C 23/02 (2006.01)
C22C 23/04 (2006.01)
C25F 3/16 (2006.01)
C25F 3/18 (2006.01)
IPC-Zusatzklasse ICA
IPC-Indexklasse ICI
Gemeinsame Patentklassifikation CPC A61F 2/06
A61L 2400/18
A61L 31/022
A61L 31/14
A61L 31/148
C22C 23/02
C22C 23/04
C23F 3/03
C23G 1/12
C25F 3/04
C25F 3/16
C25F 3/18
MCD-Hauptklasse MCM C25F 3/04 (2006.01)
MCD-Nebenklasse MCS A61F 2/06 (2006.01)
A61L 31/02 (2006.01)
A61L 31/14 (2006.01)
C22C 23/02 (2006.01)
C22C 23/04 (2006.01)
C25F 3/16 (2006.01)
C25F 3/18 (2006.01)
MCD-Zusatzklasse MCA
57 Zusammenfassung AB [EN] The production of microstructured surfaces in magnesium alloys, containing zinc as the major alloying element, in particular in absorbable implants such as stents, wherein microstructures in sizes of up to 5 µm (micrometers) are generated on a magnesium alloy base body of the absorbable implant, for example of the absorbable stent, by way of optionally combined, pickling and electrochemical micropolishing processes, and allow better adhesion of a polymer coating (including higher break resistance) and higher corrosion resistance. The microstructured surface is produced out of the bulk material and exhibits no delamination from the base material during the mechanical deformation of the implant.
56 Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt
CT US020090200178A1
US020090324684A1
US020100076556A1
56 Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt
CT EP000002668966A1
US020120143227A1
WO002005024099A1
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt
CTNP
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt
CTNP EP14150896 European Search Report mailed Aug. 31 2016. 1
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Sequenzprotokoll
Prüfstoff-IPC ICP A61F 2/06
A61L 31/02
A61L 31/14
C25F 3/04
C25F 3/16
C25F 3/18