| 54 |
Titel |
TI |
[EN] Method for hot embossing at least one conductive track onto a substrate |
| 71/73 |
Anmelder/Inhaber |
PA |
BOSCH GMBH ROBERT, DE
;
EHRENPFORDT RICARDO, DE
;
MAY JOHANNA, DE
|
| 72 |
Erfinder |
IN |
EHRENPFORDT RICARDO, DE
;
MAY JOHANNA, DE
|
| 22/96 |
Anmeldedatum |
AD |
08.07.2008 |
| 21 |
Anmeldenummer |
AN |
73348708 |
|
Anmeldeland |
AC |
US |
|
Veröffentlichungsdatum |
PUB |
08.10.2013 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
DE
102007042411
06.09.2007
|
33
31
32 |
PRC
PRN
PRD |
EP
2008058818
08.07.2008
|
| 51 |
IPC-Hauptklasse |
ICM |
H05K 3/02
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
H05K 1/0272
H05K 2201/0129
H05K 2201/09036
H05K 2201/09045
H05K 2203/0108
H05K 3/041
H05K 3/107
H05K 3/386
Y10T 156/1052
Y10T 29/49117
Y10T 29/49155
Y10T 29/4916
|
|
MCD-Hauptklasse |
MCM |
H05K 3/02
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
US000002757443A
US000002912748A
US000003037265A
US000003628243A
US000004363930A
US000004403107A
US000004532152A
US000005469615A
US000006816125B2
US000007102522B2
US000007237330B2
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
DE000019738589A1
FR000002674724A1
US020070049130A1
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
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|
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