| 54 |
Title |
TI |
[EN] Method for hot embossing at least one conductive track onto a substrate |
| 71/73 |
Applicant/owner |
PA |
BOSCH GMBH ROBERT, DE
;
EHRENPFORDT RICARDO, DE
;
MAY JOHANNA, DE
|
| 72 |
Inventor |
IN |
EHRENPFORDT RICARDO, DE
;
MAY JOHANNA, DE
|
| 22/96 |
Application date |
AD |
Jul 8, 2008 |
| 21 |
Application number |
AN |
73348708 |
|
Country of application |
AC |
US |
|
Publication date |
PUB |
Oct 8, 2013 |
33
31
32 |
Priority data |
PRC
PRN
PRD |
DE
102007042411
Sep 6, 2007
|
33
31
32 |
PRC
PRN
PRD |
EP
2008058818
Jul 8, 2008
|
| 51 |
IPC main class |
ICM |
H05K 3/02
(2006.01)
|
| 51 |
IPC secondary class |
ICS |
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
H05K 1/0272
H05K 2201/0129
H05K 2201/09036
H05K 2201/09045
H05K 2203/0108
H05K 3/041
H05K 3/107
H05K 3/386
Y10T 156/1052
Y10T 29/49117
Y10T 29/49155
Y10T 29/4916
|
|
MCD main class |
MCM |
H05K 3/02
(2006.01)
|
|
MCD secondary class |
MCS |
|
|
MCD additional class |
MCA |
|
| 57 |
Abstract |
AB |
[EN] In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction. |
| 56 |
Cited documents identified in the search |
CT |
US000002757443A
US000002912748A
US000003037265A
US000003628243A
US000004363930A
US000004403107A
US000004532152A
US000005469615A
US000006816125B2
US000007102522B2
US000007237330B2
|
| 56 |
Cited documents indicated by the applicant |
CT |
DE000019738589A1
FR000002674724A1
US020070049130A1
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
|
