| 54 |
Title |
TI |
[EN] Semiconductor component with improved robustness |
| 71/73 |
Applicant/owner |
PA |
INFINEON TECHNOLOGIES AUSTRIA, AT
;
LUTZ JOSEF, DE
;
SCHULZE HANS-JOACHIM, DE
|
| 72 |
Inventor |
IN |
LUTZ JOSEF, DE
;
SCHULZE HANS-JOACHIM, DE
|
| 22/96 |
Application date |
AD |
Oct 1, 2007 |
| 21 |
Application number |
AN |
86531607 |
|
Country of application |
AC |
US |
|
Publication date |
PUB |
Jan 15, 2013 |
33 31 32 |
Priority data |
PRC PRN PRD |
DE
102006046845
20061002
|
| 51 |
IPC main class |
ICM |
H01L 29/66
(2006.01)
|
| 51 |
IPC secondary class |
ICS |
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
H10D 10/00
H10D 10/40
H10D 12/441
H10D 18/241
H10D 30/66
H10D 62/137
H10D 62/157
H10D 62/60
H10D 64/256
H10D 8/00
H10D 8/60
H10D 8/80
|
|
MCD main class |
MCM |
H01L 29/66
(2006.01)
|
|
MCD secondary class |
MCS |
|
|
MCD additional class |
MCA |
|
| 57 |
Abstract |
AB |
[EN] One aspect is a semiconductor component including a terminal zone; a drift zone of a first conduction type, which is doped more weakly than the terminal zone; a component junction between the drift zone and a further component zone; and a charge carrier compensation zone of the first conduction type, which is arranged between the drift zone and the terminal zone and whose doping concentration is lower than that of the terminal zone, and whose doping concentration increases at least in sections in the direction of the terminal zone from a minimum doping concentration to a maximum doping concentration, the minimum doping concentration being more than 1016 cm−3. |
| 56 |
Cited documents identified in the search |
CT |
US020050133858A1 US020060286753A1
|
| 56 |
Cited documents indicated by the applicant |
CT |
DE000003932490A1 DE000010053445A1 DE000010245091A1 DE000010360574A1 DE102004039209A1 DE102005009000A1 US000003872494A US000006384431B1 US020050133857A1 US020060035436A1 US020060211179A1
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
Egawa, Hideharu, "Avalanche Characteristics and Failure Mechanism of High Voltage Diodes," IEEE Transactions on Electron Devices, vol. ED-13, No. 11, pp. 754-758 (Nov. 1966). 1; Hower, Philip L., "Avalanche Injection and Second Breakdown in Transistors," IEEE Transactions on Electron Devices, vol. ED-17, No. 4, pp. 320-335 (Apr. 1970). 1; Kaindl, W. et al., "Physically Based Simulation of Strong Charger Multiplication Events in Power Devices Triggered by Incident Ions," Proceedings of 2004 International Symposium on Power Semiconductor Devices & ICs, Kitakyushu, pp. 257-260 (2004). 1; Soelkner, G. et al., "Charge Carrier Avalanche Multiplication in High-Voltage Diodes Triggered by Ionizing Radiation," IEEE Transactions on Nuclear Science, vol. 47, No. 6, pp. 2365-2372 (Dec. 2000). 1
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Citing documents |
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Determine documents
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Sequence listings |
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Search file IPC |
ICP |
H01L 29/06 E
H01L 29/74
H01L 29/78
|