| 54 |
Titel |
TI |
[EN] Chip arrangement |
| 71/73 |
Anmelder/Inhaber |
PA |
MICRONAS GMBH, US
|
| 72 |
Erfinder |
IN |
BAUMANN WERNER, DE
;
EHRET RALF, DE
;
GAHLE HANS-JUERGEN, DE
;
IGEL GUENTER, DE
;
LEHMANN MIRKO, DE
;
SIEBEN ULRICH, DE
;
WOLF BERNHARD, DE
|
| 22/96 |
Anmeldedatum |
AD |
29.06.1999 |
| 21 |
Anmeldenummer |
AN |
34269799 |
|
Anmeldeland |
AC |
US |
|
Veröffentlichungsdatum |
PUB |
11.09.2001 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
DE
19829121
19980630
|
| 51 |
IPC-Hauptklasse |
ICM |
H01L 23/495
|
| 51 |
IPC-Nebenklasse |
ICS |
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
A61B 5/14532
A61B 5/1473
G01N 33/48707
H01L 23/5385
H01L 2924/0002
|
|
MCD-Hauptklasse |
MCM |
C12M 1/00
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
G01N 27/00
(2006.01)
G01N 27/28
(2006.01)
G01N 27/30
(2006.01)
H01L 23/538
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
A61B 5/00
(2006.01)
G01N 33/487
(2006.01)
|
| 57 |
Zusammenfassung |
AB |
[EN] A chip arrangement (1) has a substrate board (2) with an opening (3), into which a carrier chip (4) is inserted, which has an electrical or electronic structural component (5). At least one conductor path (7) is integrated into the carrier chip (4), which connects the structural component (5) to the electrical connection contact (8). The carrier chip (4) is inserted into the opening (3) in such a way that its ends project beyond the opposite-facing, flat-sided surfaces (9, 9') of the substrate board (2), and thereby form overhangs (10, 10'). Here, the structural component is arranged on the overhang (10) projecting beyond the one surface (9), and the connection contact (8) is arranged on the overhang (10') projecting beyond the other surface (9'), and the conductor path (7) connecting the structural component (5) and the connection contact (8) passes through the opening (3). A seal is arranged between the substrate board (2) and the carrier chip (4). |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
US000003601699A
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
DE000002822391A1
EP000000190005A2
EP000000399227A1
JP000H07103934A
US000005114859A
WO001987005747A1
WO001997042478A1
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
B81B 7/02
B81C 3/00
|
