| 54 |
Title |
TI |
[EN] CHIP DEVICE |
| 71/73 |
Applicant/owner |
PA |
MICRONAS INTERMETALL GMBH
|
| 72 |
Inventor |
IN |
BAUMANN WERNER DR
;
EHRET RALF DR
;
GAHLE HANS-JUERGEN DR
;
IGEL GUENTER
;
LEHMANN MIRKO
;
SIEBEN ULRICH
;
WOLF BERNHARD
|
| 22/96 |
Application date |
AD |
Jun 29, 1999 |
| 21 |
Application number |
AN |
18410799 |
|
Country of application |
AC |
JP |
|
Publication date |
PUB |
Feb 25, 2000 |
33
31
32 |
Priority data |
PRC
PRN
PRD |
DE
19829121
19980630
|
| 51 |
IPC main class |
ICM |
G01N 27/00
|
| 51 |
IPC secondary class |
ICS |
G01N 27/30
|
|
IPC additional class |
ICA |
C12M 1/00
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
A61B 5/14532
A61B 5/1473
G01N 33/48707
H01L 23/5385
H01L 2924/0002
|
|
MCD main class |
MCM |
C12M 1/00
(2006.01)
|
|
MCD secondary class |
MCS |
G01N 27/00
(2006.01)
G01N 27/28
(2006.01)
G01N 27/30
(2006.01)
H01L 23/538
(2006.01)
|
|
MCD additional class |
MCA |
A61B 5/00
(2006.01)
G01N 33/487
(2006.01)
|
| 57 |
Abstract |
AB |
[EN] PROBLEM TO BE SOLVED: To provide structure that cannot be corroded by an object to be inspected, is simple, and has reduced costs in a chip device where a support chip is inserted into the through hole of a substrate plate and the support chip is provided with a conductor path for connecting an electronic element to a contact. SOLUTION: The end part of a support chip is inserted into a through hole in the support chip so that surfaces 9 and 9' at the side of a wide width opposing each other of a substrate plate project for forming projecting parts 10 and 10'. An element is arranged at the projecting part on the surface at one side with a wide width, a connection contact is arranged at the projecting part on the surface of the other side with a wide width, and a conductor path for connecting the element and the connection contact is fed through a through hole. In this case, sealing is made between the substrate plate and the support chip. |
| 56 |
Cited documents identified in the search |
CT |
|
| 56 |
Cited documents indicated by the applicant |
CT |
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
B81C 3/00
G01N 27/00
|
