| 54 |
Titel |
TI |
[EN] CHIP DEVICE |
| 71/73 |
Anmelder/Inhaber |
PA |
MICRONAS INTERMETALL GMBH
|
| 72 |
Erfinder |
IN |
BAUMANN WERNER DR
;
EHRET RALF DR
;
GAHLE HANS-JUERGEN DR
;
IGEL GUENTER
;
LEHMANN MIRKO
;
SIEBEN ULRICH
;
WOLF BERNHARD
|
| 22/96 |
Anmeldedatum |
AD |
29.06.1999 |
| 21 |
Anmeldenummer |
AN |
18410799 |
|
Anmeldeland |
AC |
JP |
|
Veröffentlichungsdatum |
PUB |
25.02.2000 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
DE
19829121
19980630
|
| 51 |
IPC-Hauptklasse |
ICM |
G01N 27/00
|
| 51 |
IPC-Nebenklasse |
ICS |
G01N 27/30
|
|
IPC-Zusatzklasse |
ICA |
C12M 1/00
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
A61B 5/14532
A61B 5/1473
G01N 33/48707
H01L 23/5385
H01L 2924/0002
|
|
MCD-Hauptklasse |
MCM |
C12M 1/00
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
G01N 27/00
(2006.01)
G01N 27/28
(2006.01)
G01N 27/30
(2006.01)
H01L 23/538
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
A61B 5/00
(2006.01)
G01N 33/487
(2006.01)
|
| 57 |
Zusammenfassung |
AB |
[EN] PROBLEM TO BE SOLVED: To provide structure that cannot be corroded by an object to be inspected, is simple, and has reduced costs in a chip device where a support chip is inserted into the through hole of a substrate plate and the support chip is provided with a conductor path for connecting an electronic element to a contact. SOLUTION: The end part of a support chip is inserted into a through hole in the support chip so that surfaces 9 and 9' at the side of a wide width opposing each other of a substrate plate project for forming projecting parts 10 and 10'. An element is arranged at the projecting part on the surface at one side with a wide width, a connection contact is arranged at the projecting part on the surface of the other side with a wide width, and a conductor path for connecting the element and the connection contact is fed through a through hole. In this case, sealing is made between the substrate plate and the support chip. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
B81C 3/00
G01N 27/00
|
