54 |
Title |
TI |
[DE] MECHANISCHE STABILISIERUNG UND ELEKTRISCHE SOWIE HYDRAULISCHE ADAPTIERUNG EINES SILIZIUM CHIPS DURCH KERAMIKEN [EN] MECHANICAL STABILIZATION AND ELECTRICAL AND HYDRAULIC ADAPTATION OF A SILICON CHIP BY CERAMICS [FR] STABILISATION MÉCANIQUE ET ADAPTATION ÉLECTRIQUE AINSI QU'HYDRAULIQUE D'UNE PUCE DE SILICIUM PAR DES CÉRAMIQUES |
71/73 |
Applicant/owner |
PA |
ENDRESS & HAUSER GMBH & CO KG, DE
|
72 |
Inventor |
IN |
LEMKE BENJAMIN, DE
;
TEIPEN RAFAEL, DE
;
THAM ANH TUAN, DE
|
22/96 |
Application date |
AD |
Dec 6, 2013 |
21 |
Application number |
AN |
13802350 |
|
Country of application |
AC |
EP |
|
Publication date |
PUB |
Oct 28, 2015 |
33 31 32 |
Priority data |
PRC PRN PRD |
DE
102012113033
Dec 21, 2012
|
33 31 32 |
PRC PRN PRD |
EP
2013075764
Dec 6, 2013
|
51 |
IPC main class |
ICM |
G01L 19/06
(2006.01)
|
51 |
IPC secondary class |
ICS |
G01L 13/02
(2006.01)
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
G01L 13/025
G01L 19/0618
|
|
MCD main class |
MCM |
G01L 19/06
(2006.01)
|
|
MCD secondary class |
MCS |
G01L 13/02
(2006.01)
|
|
MCD additional class |
MCA |
|
57 |
Abstract |
AB |
|
56 |
Cited documents identified in the search |
CT |
|
56 |
Cited documents indicated by the applicant |
CT |
|
56 |
Cited non-patent literature identified in the search |
CTNP |
|
56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
G01L 13/02
|