| 54 |
Title |
TI |
[DE] Chip-Anordnung
[EN] Chip-arrangement
[FR] Agencement de puce électronique |
| 71/73 |
Applicant/owner |
PA |
MICRONAS GMBH, DE
|
| 72 |
Inventor |
IN |
BAUMANN WERNER DR, DE
;
EHRET RALF DR, DE
;
GAHLE HANS-JUERGEN DR, DE
;
IGEL GUENTER DIPL-ING, DE
;
LEHMANN MIRKO DIPL-PHYS, DE
;
SIEBEN ULRICH DR, DE
|
| 22/96 |
Application date |
AD |
Jun 23, 1999 |
| 21 |
Application number |
AN |
01126916 |
|
Country of application |
AC |
EP |
|
Publication date |
PUB |
Aug 22, 2007 |
33
31
32 |
Priority data |
PRC
PRN
PRD |
DE
19829121
Jun 30, 1998
|
33
31
32 |
PRC
PRN
PRD |
EP
99112071
Jun 23, 1999
|
| 51 |
IPC main class |
ICM |
H01L 25/065
(2006.01)
|
| 51 |
IPC secondary class |
ICS |
A61B 5/00
(2006.01)
A61M 37/00
(2006.01)
G01N 27/28
(2006.01)
G01N 27/403
(2006.01)
G01N 27/414
(2006.01)
G01N 33/487
(2006.01)
H01L 25/07
(2006.01)
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
A61B 5/14532
A61B 5/1473
A61B 5/441
G01N 21/01
G01N 33/48707
H01L 23/5385
H01L 25/07
H01L 2924/0002
|
|
MCD main class |
MCM |
H01L 25/065
(2006.01)
|
|
MCD secondary class |
MCS |
A61B 5/00
(2006.01)
A61B 5/15
(2006.01)
A61M 37/00
(2006.01)
G01N 21/01
(2006.01)
G01N 27/28
(2006.01)
G01N 27/403
(2006.01)
G01N 27/414
(2006.01)
G01N 33/487
(2006.01)
H01L 23/538
(2006.01)
H01L 25/07
(2006.01)
|
|
MCD additional class |
MCA |
A61B 5/103
(2006.01)
|
| 57 |
Abstract |
AB |
|
| 56 |
Cited documents identified in the search |
CT |
|
| 56 |
Cited documents indicated by the applicant |
CT |
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
A61B 5/00
H01L 25/065
|
