| 54 |
Title |
TI |
[DE] Kühlkörper mit mehreren sequentiell durchflossenen Kühlzonen
[EN] Electronic component e.g. integrated circuit, surface cooling device for computing system, has heat exchange chamber through which fluid flows, where surfaces of chambers are segmented to sequentially draining zones |
| 71/73 |
Applicant/owner |
PA |
Aqua Computer GmbH & Co. KG, 37130 Gleichen, DE
|
| 72 |
Inventor |
IN |
|
| 22/96 |
Application date |
AD |
Apr 20, 2007 |
| 21 |
Application number |
AN |
202007005837 |
|
Country of application |
AC |
DE |
|
Publication date |
PUB |
Aug 30, 2007 |
33
31
32 |
Priority data |
PRC
PRN
PRD |
|
| 51 |
IPC main class |
ICM |
F28F 13/06
(2006.01)
|
| 51 |
IPC secondary class |
ICS |
G06F 1/20
(2006.01)
H01L 23/473
(2006.01)
H05K 7/20
(2006.01)
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
F28F 3/12
H01L 23/473
H01L 2924/0002
|
|
MCD main class |
MCM |
F28F 13/06
(2006.01)
|
|
MCD secondary class |
MCS |
G06F 1/20
(2006.01)
H01L 23/473
(2006.01)
H05K 7/20
(2006.01)
|
|
MCD additional class |
MCA |
|
| 57 |
Abstract |
AB |
[EN] The device has heat exchange chambers (4) via which fluid flows. The chambers are spatially separated from one another. A metallic base (1) is connected with a housing of a cooling body (2). The chambers transfer the heat of heat sources to the fluid. A cooling medium flows to one chamber through a nozzle (5) and is then led to next chamber. The surfaces of the chambers are segmented to several sequentially draining zones. |
| 56 |
Cited documents identified in the search |
CT |
|
| 56 |
Cited documents indicated by the applicant |
CT |
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
F28F 13/06
G06F 1/20
H01L 23/473
H05K 7/20 B
|
