54 |
Title |
TI |
[DE] Adsorptionswärmepumpe mit Zweiphasen-Thermosiphon als thermische Dioden [EN] Zeolite heat pump has two-phase thermosiphon that is formed as thermal diode, where absorbent, evaporation part of hot thermosiphon and condensation part of cold thermosiphon are located in container |
71/73 |
Applicant/owner |
PA |
Enders, Torsten, 09496, Marienberg, DE
;
Klotsche, Michael, Dipl.-Ing. Univ., 01809, Heidenau, DE
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72 |
Inventor |
IN |
Enders, Torsten, 09496, Marienberg, DE
;
Klotsche, Michael, Dipl.-Ing. Univ., 01809, Heidenau, DE
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22/96 |
Application date |
AD |
Jun 8, 2010 |
21 |
Application number |
AN |
102010022941 |
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Country of application |
AC |
DE |
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Publication date |
PUB |
Dec 8, 2011 |
33 31 32 |
Priority data |
PRC PRN PRD |
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51 |
IPC main class |
ICM |
F25B 30/04
(2006.01)
|
51 |
IPC secondary class |
ICS |
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IPC additional class |
ICA |
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IPC index class |
ICI |
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Cooperative patent classification |
CPC |
F25B 17/08
F25B 30/04
Y02A 30/27
Y02B 30/62
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MCD main class |
MCM |
F25B 30/04
(2006.01)
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MCD secondary class |
MCS |
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MCD additional class |
MCA |
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57 |
Abstract |
AB |
[DE] Zeolithwärmepumpe mit Zweiphasen-Thermosiphons als thermische Dioden, dadurch gekennzeichnet dass sich das Adsorptionsmittel, der Verdampfungsteil des warmen Thermosiphons und der Kondensationsteil des kalten Thermosiphons in einem Behälter befinden. [EN] The zeolite heat pump has two-phase thermosiphon that is formed as thermal diode, where an absorbent (8), an evaporation part of the hot thermosiphon (3) and a condensation part of the cold thermosiphon (4) are located in a container (1). The absorbent is located in contact with the upper surface of a heat exchanger (7). |
56 |
Cited documents identified in the search |
CT |
US000005157937A US000005408847A
|
56 |
Cited documents indicated by the applicant |
CT |
DE000010217443B4
|
56 |
Cited non-patent literature identified in the search |
CTNP |
|
56 |
Cited non-patent literature indicated by the applicant |
CTNP |
Peterson, G. P: An Introduction to Heatpipes - Modelling, Testing and Applications. John Wiley & Sons. New York, 1994. Seite 218 1
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Citing documents |
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No results
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Sequence listings |
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Search file IPC |
ICP |
F25B 30/04
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