| 54 |
Titel |
TI |
[DE] Vakuumschalter für Mittel- und Hochspannungen |
| 71/73 |
Anmelder/Inhaber |
PA |
Switchcraft Europe GmbH, 46539 Dinslaken, DE
|
| 72 |
Erfinder |
IN |
Bodenstein, Klaus, 30952 Ronnenberg, DE
;
Lange, Detlef, 46145 Oberhausen, DE
|
| 22/96 |
Anmeldedatum |
AD |
07.09.2006 |
| 21 |
Anmeldenummer |
AN |
102006042101 |
|
Anmeldeland |
AC |
DE |
|
Veröffentlichungsdatum |
PUB |
25.09.2008 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
|
| 51 |
IPC-Hauptklasse |
ICM |
H01H 33/662
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
H01H 1/58
(2006.01)
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
H01H 1/50
H01H 1/5822
H01H 2001/5827
H01H 2033/6648
H01H 33/66
H01H 33/6606
H01H 33/662
H01H 33/664
H01H 33/666
|
|
MCD-Hauptklasse |
MCM |
H01H 33/662
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
H01H 1/58
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] The invention relates to a vacuum switch, especially a vacuum circuit breaker, for medium and high voltages, comprising a mobile switch unit arranged inside a vacuum switch compartment (1) and provided with mutually mobile elements including a contact tappet (17), an insulator (18), and a driving or switching rod (11) introduced into the vacuum switch compartment (1) by means of metal bellows. Said vacuum switch also comprises a fixed contact inserted into the housing of the vacuum switch compartment (1). The upper end of the insulator (18) is fixed to the contact tappet (17), and the lower end of the insulator (18) is fixed to the driving or switching rod (11). The contact tappet (17) is connected to a conductor (8) by a flexible, electroconductive connection (20), said conductor being electroconductively connected to at least one laterally arranged output contact (6). The aim of the invention is to enable a simplified, more economical and improved design of a flexible conductive connection to the output contact. To this end, the inner cross-sectional surface of the vacuum switch compartment (1) is covered, at the level of the at least one output contact (6), around the contact tappet (17), by film-type or plate-type electroconductive covering elements (26) which are arranged over each other in layers and at least partially cover each other. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
DE000019505370C2
DE000019712182A1
DE000019964249C2
WO001990001788A1
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
H01H 1/58
H01H 33/662
H01H 33/66
|
