| 54 |
Title |
TI |
[DE] Magnetsensoranordnung
[EN] Magnetic sensor array has one magnetic field sensor element whose electrical characteristics changes as function of magnetic field of working magnet and which is raised on flux controlling lead frame |
| 71/73 |
Applicant/owner |
PA |
Robert Bosch GmbH, 70469 Stuttgart, DE
|
| 72 |
Inventor |
IN |
Bauer, Christian, 71701 Schwieberdingen, DE
;
Rettig, Rasmus, 70839 Gerlingen, DE
;
Vogelgesang, Birgit, 74379 Ingersheim, DE
|
| 22/96 |
Application date |
AD |
Dec 15, 2004 |
| 21 |
Application number |
AN |
102004060298 |
|
Country of application |
AC |
DE |
|
Publication date |
PUB |
Jun 22, 2006 |
33
31
32 |
Priority data |
PRC
PRN
PRD |
|
| 51 |
IPC main class |
ICM |
G01R 33/02
(2006.01)
|
| 51 |
IPC secondary class |
ICS |
G01B 7/30
(2006.01)
G01D 5/14
(2006.01)
G01D 5/16
(2006.01)
G01D 5/18
(2006.01)
G01D 5/20
(2006.01)
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
G01D 5/14
G01R 33/02
H01L 2224/48091
H01L 2224/48247
|
|
MCD main class |
MCM |
G01R 33/02
(2006.01)
|
|
MCD secondary class |
MCS |
G01B 7/30
(2006.01)
G01D 5/14
(2006.01)
G01D 5/16
(2006.01)
G01D 5/18
(2006.01)
G01D 5/20
(2006.01)
|
|
MCD additional class |
MCA |
|
| 57 |
Abstract |
AB |
[DE] Es wird eine Magnetsensoranordnung mit mindestens einem magnetfeldempfindlichen Sensorelement (2) vorgeschlagen, dessen elektrische Eigenschaften in Abhängigkeit von einem Magnetfeld eines Arbeitsmagneten (10) veränderbar sind, das durch ein bewegtes Geberelement beeinflussbar ist. Das magnetfeldempfindliche Sensorelement (2) ist auf einem flussleitenden Leadframe (1; 9) aufgebracht, wobei die elektrische Kontaktierung und die mechanische Halterung des Sensorelements (2) über Teile des Leadframes (1; 9) erfolgt.
[EN] The magnetic sensor array has at least one magnetic field sensor element (2) whose electrical characteristics changes as a function of magnetic field of a working magnet. The magnetic field sensitive element is raised on the flux controlling lead frame (1). The electrical contacting and mechanical attachment of the sensor element takes place over the parts of the lead frame. |
| 56 |
Cited documents identified in the search |
CT |
CH000000683469A
DE000010009173A1
DE000010314602A1
JP000S57147289A
|
| 56 |
Cited documents indicated by the applicant |
CT |
|
| 56 |
Cited non-patent literature identified in the search |
CTNP |
|
| 56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
G01B 7/30
G01D 5/14
G01D 5/16
G01D 5/18
G01D 5/20
G01R 33/02
|
