Bibliographic data

Document DE000020302201U1 (Pages: 5)

Bibliographic data Document DE000020302201U1 (Pages: 5)
INID Criterion Field Contents
54 Title TI [DE] Sequentiell umflossene Temperiereinrichtung
[EN] Cooling system for semiconductors has flow passage formed to provide uniform effect
71/73 Applicant/owner PA May, Stefan, 37077 Göttingen, DE ; Wille, Stephan, 37130 Gleichen, DE
72 Inventor IN
22/96 Application date AD Feb 12, 2003
21 Application number AN 20302201
Country of application AC DE
Publication date PUB May 28, 2003
33
31
32		 Priority data PRC
PRN
PRD

51 IPC main class ICM G06F 1/20
51 IPC secondary class ICS
IPC additional class ICA
IPC index class ICI
Cooperative patent classification CPC H01L 23/473
H01L 2924/0002
MCD main class MCM
MCD secondary class MCS H01L 23/473 (2006.01)
MCD additional class MCA
57 Abstract AB [EN] The cooling element [2] is positioned within a housing [1] with a gap in between [6]. Cooling fluid is pumped around the gap with an inlet on one side [3] and an outlet [4] on the other side. A bridging section connects the parts together [5].
56 Cited documents identified in the search CT
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56 Cited non-patent literature identified in the search CTNP
56 Cited non-patent literature indicated by the applicant CTNP
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