Bibliografische Daten

Dokument DE000010242191B4 (Seiten: 4)

Bibliografische Daten Dokument DE000010242191B4 (Seiten: 4)
INID Kriterium Feld Inhalt
54 Titel TI [DE] Verfahren für die Herstellung von hitzebeständigen Gießformen
71/73 Anmelder/Inhaber PA ACTech GmbH, 09599 Freiberg, DE
72 Erfinder IN Alijew, Reso, Dr., 09599 Freiberg, DE ; Gantner, Detlev, 09599 Freiberg, DE
22/96 Anmeldedatum AD 10.09.2002
21 Anmeldenummer AN 10242191
Anmeldeland AC DE
Veröffentlichungsdatum PUB 05.02.2009
33
31
32
Priorität PRC
PRN
PRD
DE
10147843
20010927
51 IPC-Hauptklasse ICM B23C 3/00 (2006.01)
51 IPC-Nebenklasse ICS B22C 9/02 (2006.01)
B23C 5/02 (2006.01)
IPC-Zusatzklasse ICA
IPC-Indexklasse ICI
Gemeinsame Patentklassifikation CPC B22C 9/02
B23C 3/00
B23C 5/1081
Y10T 409/303752
Y10T 409/304424
MCD-Hauptklasse MCM B22C 7/00 (2006.01)
B23C 3/00 (2006.01)
MCD-Nebenklasse MCS B22C 9/02 (2006.01)
B23C 5/02 (2006.01)
B23C 5/10 (2006.01)
MCD-Zusatzklasse MCA
57 Zusammenfassung AB [EN] The invention relates to a method for producing heat-resistant casting molds from molding sand containing binder, particularly for producing an inner contour of casting molds for prototypes, large volumes and deep grooves often being produced especially in the machining of molds for rapid production of prototypes from casting materials. To increase efficiency, in a first step blocks of molding material are produced whose dimensions correspond to a mold cavity depth typically of 300 mm to 400 mm. The inner contour of the mold is then produced oversized with spacing close to the contour of the inner wall of the mold cavity by means of a roughing tool ( 4 ) that has an effective cutting diameter of 12 mm to 35 mm. The mold cavity is then machined by fast milling away of the oversize material following the contour, with a finishing cutter ( 3 ) that has a diameter-to-length ratio between 1:10 and 1:30.
56 Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt
CT DE000019721900C2
DE000019928840C1
56 Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt
CT
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt
CTNP
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt
CTNP
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Sequenzprotokoll
Prüfstoff-IPC ICP B22C 1/16
B22C 9/02
B23C 3/00
B23C 5/02