54 |
Title |
TI |
[DE] Verfahren zum Ausbilden eines Kompensationsgebiets [EN] Production of a compensation region used in semiconductors comprises forming primary doping material depots of first p-conductivity in a first region in a laterally displaced manner, and diffusing out the primary doping material depots |
71/73 |
Applicant/owner |
PA |
Infineon Technologies AG, 81669 München, DE
|
72 |
Inventor |
IN |
Rüb, Michael, Dr., Faak am See, AT
|
22/96 |
Application date |
AD |
Aug 28, 2002 |
21 |
Application number |
AN |
10239580 |
|
Country of application |
AC |
DE |
|
Publication date |
PUB |
Mar 18, 2004 |
33 31 32 |
Priority data |
PRC PRN PRD |
|
51 |
IPC main class |
ICM |
H01L 21/334
|
51 |
IPC secondary class |
ICS |
H01L 21/328
H01L 29/06
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
H01L 29/0634
H01L 29/41766
H01L 29/66136
H01L 29/66295
H01L 29/66333
H01L 29/66363
H01L 29/66712
H01L 29/7802
|
|
MCD main class |
MCM |
|
|
MCD secondary class |
MCS |
H01L 21/329
(2006.01)
H01L 21/331
(2006.01)
H01L 21/332
(2006.01)
H01L 21/336
(2006.01)
H01L 29/06
(2006.01)
H01L 29/78
(2006.01)
|
|
MCD additional class |
MCA |
|
57 |
Abstract |
AB |
[DE] Um ein Kompensationsgebiet (30) für ein Kompensationshalbleiterbauelement (10) auf besonders einfache Art und Weise und doch wohldefiniert und zuverlässig herstellen zu können, wird vorgeschlagen, primäre Dotierstoffdepots (31, 32, 33) zueinander lateral versetzt in einem ersten Bereich (21) eines Halbleitermaterialbereichs (20) auszubilden und dann nachfolgend durch Ausdiffundieren über eine entsprechende Überlagerung daraus entstehender sekundärer Dotierstoffdepots (31', 32', 33') in das entsprechende Kompensationsgebiet (30) in zusammenhängender Form derart auszubilden, dass sich das Kompensationsgebiet (30) zumindest zum Teil lateral erstreckt. [EN] Production of a compensation region comprises forming primary doping material depots (31, 32, 33) of first p-conductivity in a first region (21) or second n-conductivity in a semiconductor material region (20) in a laterally displaced manner, and diffusing out the primary doping material depots in the first region forming a compensation region as a superposition made from secondary doping material depots (31', 32', 33') produced from the primary doping material depots. Independent claims are also included for the following: (1) Compensation semiconductor component; and (2) Process for the production of the compensation semiconductor component. |
56 |
Cited documents identified in the search |
CT |
DE000010008570A1
|
56 |
Cited documents indicated by the applicant |
CT |
|
56 |
Cited non-patent literature identified in the search |
CTNP |
|
56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
H01L 21/334
H01L 29/06 E
|