54 |
Title |
TI |
[DE] Randabschluss für Hochvolt-Halbleiterbauelement und Verfahren zum Herstellen eines Isolationstrenches in einem Halbleiterkörper für solchen Randabschluss |
71/73 |
Applicant/owner |
PA |
Infineon Technologies AG, 81669 München, DE
|
72 |
Inventor |
IN |
Ahlers, Dirk, 80796 München, DE
;
Detzel, Thomas, Villach, AT
;
Friza, Wolfgang, Villach, AT
;
Rüb, Michael, Faak, AT
|
22/96 |
Application date |
AD |
Oct 19, 2000 |
21 |
Application number |
AN |
10051909 |
|
Country of application |
AC |
DE |
|
Publication date |
PUB |
Mar 22, 2007 |
33 31 32 |
Priority data |
PRC PRN PRD |
|
51 |
IPC main class |
ICM |
H01L 29/06
(2006.01)
|
51 |
IPC secondary class |
ICS |
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
H01L 29/0649
H01L 29/402
H01L 29/407
|
|
MCD main class |
MCM |
H01L 29/06
(2006.01)
|
|
MCD secondary class |
MCS |
H01L 29/40
(2006.01)
|
|
MCD additional class |
MCA |
|
57 |
Abstract |
AB |
|
56 |
Cited documents identified in the search |
CT |
DE000003825547A1 DE000019531369A1 DE000069005805T2 EP000000436171B1 US000004927772A US000005113237A US000005266831A US000005486718A US000005714396A WO002000038242A1
|
56 |
Cited documents indicated by the applicant |
CT |
|
56 |
Cited non-patent literature identified in the search |
CTNP |
|
56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
No results
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
H01L 29/06 E
H01L 29/78
|