54 |
Title |
TI |
[DE] Randabschluss für Hochvolt-Halbleiterbauelement und Verfahren zum Herstellen eines Isolatorgebietes in einem Halbleiterkörper für solchen Randabschluss [EN] Edge border used for high voltage semiconductor component has the site of the bend and sealing of equipotential lines applied using a voltage in an insulating region |
71/73 |
Applicant/owner |
PA |
Infineon Technologies AG, 81669 München, DE
|
72 |
Inventor |
IN |
Ahlers, Dirk, 80796 München, DE
;
Detzel, Thomas, Villach, AT
;
Friza, Wolfgang, Villach, AT
;
Rüb, Michael, Faak, AT
|
22/96 |
Application date |
AD |
Oct 19, 2000 |
21 |
Application number |
AN |
10051909 |
|
Country of application |
AC |
DE |
|
Publication date |
PUB |
May 16, 2002 |
33 31 32 |
Priority data |
PRC PRN PRD |
|
51 |
IPC main class |
ICM |
H01L 29/06
|
51 |
IPC secondary class |
ICS |
|
|
IPC additional class |
ICA |
|
|
IPC index class |
ICI |
|
|
Cooperative patent classification |
CPC |
H01L 29/0649
H01L 29/402
H01L 29/407
|
|
MCD main class |
MCM |
|
|
MCD secondary class |
MCS |
H01L 29/06
(2006.01)
H01L 29/40
(2006.01)
|
|
MCD additional class |
MCA |
|
57 |
Abstract |
AB |
[DE] Die Erfindung betrifft einen Randabschluss für ein Hochvolt-Halbleiterbauelement, bei dem der Ort der Krümmung und Verdichtung von Äquipotentiallinien (9) in ein vertikal verlaufendes Isolatorgebiet (6) verlegt ist. Außerdem bezieht sich die Erfindung auf ein Verfahren zum Herstellen eines solchen Isolatorgebietes (6) durch Ätzen, thermisches Oxidieren und Verfüllen von wenigstens zwei Gräben (10'). [EN] Edge border comprises: a semiconductor body (1) of one conducting type with semiconducting regions (2,3) on an edge surface region bordering a first main surface; and a field plate (4) arranged on the edge surface region and the first main surface. The site of the bend and sealing of equipotential lines (9) is applied using a voltage in an insulating region (6). An Independent claim is also included for a process for the production of an insulating region in a semiconductor body. Preferred Features: The insulating region is an insulating region extending vertically from the first main surface into the semiconductor body. |
56 |
Cited documents identified in the search |
CT |
DE000003825547A1 WO002000038242A1
|
56 |
Cited documents indicated by the applicant |
CT |
|
56 |
Cited non-patent literature identified in the search |
CTNP |
|
56 |
Cited non-patent literature indicated by the applicant |
CTNP |
|
|
Citing documents |
|
Determine documents
|
|
Sequence listings |
|
|
|
Search file IPC |
ICP |
H01L 29/06 E
H01L 29/78
|