Bibliographic data

Document DE000010006523A1 (Pages: 10)

Bibliographic data Document DE000010006523A1 (Pages: 10)
INID Criterion Field Contents
54 Title TI [DE] Implantationsmaske für Hochenergieionenimplantation
71/73 Applicant/owner PA Infineon Technologies AG, 81669 München, DE
72 Inventor IN Lehmann, Volker, 80689 München, DE ; Rüb, Michael, Villach, AT ; Tihanyi, Jenö, 85551 Kirchheim, DE
22/96 Application date AD Feb 15, 2000
21 Application number AN 10006523
Country of application AC DE
Publication date PUB Aug 23, 2001
33
31
32		 Priority data PRC
PRN
PRD

51 IPC main class ICM H01L 21/266
51 IPC secondary class ICS
IPC additional class ICA
IPC index class ICI
Cooperative patent classification CPC H01L 21/266
H10D 62/111
MCD main class MCM
MCD secondary class MCS H01L 21/266 (2006.01)
H01L 29/06 (2006.01)
MCD additional class MCA
57 Abstract AB [DE] Die Erfindung betrifft eine wiederverwendbare Implantationsmaske (5) aus vorzugsweise Silizium mit speziell strukturierten Gräben und Löchern (2 bzw. 3), die direkt oder im Abstand von einem Devicewafer (7) vorgesehen wird, sowie ein Verfahren zum Justieren einer Weiterbehandlungsebene auf einer Implantationsebene bei einem mit einer solchen Implantationsmaske behandelten Halbleiterwafer (7).
[EN] The invention relates to a re-usable implantation mask (5), preferably made of silicon, comprising specially structured trenches and holes(2 or 3), which is provided directly or at a distance from a device wafer (7). The invention also relates to a method for adjusting a further processing plane on an implantation plane in a semiconductor wafer (7) fitted with one such implementation mask.
56 Cited documents identified in the search CT DE000002454714B2
DE000003123949A1
DE000019835528A1
DE000019838263A1
DE000019910392A1
DE000069306473T2
EP000000078336B1
JP000S58106822A
US000004021276A
US000004256532A
US000004293374A
US000005156994A
56 Cited documents indicated by the applicant CT
56 Cited non-patent literature identified in the search CTNP
56 Cited non-patent literature indicated by the applicant CTNP
Citing documents Determine documents
Sequence listings
Search file IPC ICP H01L 21/266
H01L 21/58 DB