| 54 |
Titel |
TI |
[EN] Fiber optic coupler array |
| 71/73 |
Anmelder/Inhaber |
PA |
OPEL SOLAR INC
;
UNIV CONNECTICUT
|
| 72 |
Erfinder |
IN |
TAYLOR GEOFF W
;
ZHANG YAN
|
| 22/96 |
Anmeldedatum |
AD |
12.12.2013 |
| 21 |
Anmeldenummer |
AN |
201380065181 |
|
Anmeldeland |
AC |
CN |
|
Veröffentlichungsdatum |
PUB |
04.11.2015 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
US
201261736768
13.12.2012
|
33
31
32 |
PRC
PRN
PRD |
US
2013074658
12.12.2013
|
| 51 |
IPC-Hauptklasse |
ICM |
G02B 6/26
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
G02B 6/36
(2006.01)
G02B 6/42
(2006.01)
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
G02B 6/1228
G02B 6/14
G02B 6/305
G02B 6/421
G02B 6/423
G02B 6/4249
G02B 6/4257
|
|
MCD-Hauptklasse |
MCM |
G02B 6/26
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
G02B 6/36
(2006.01)
G02B 6/42
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] An assembly includes optical fibers each having a waveguide core, a photonic integrated circuit (IC) that includes in-plane waveguides corresponding to the optical fibers, and a substrate bonded to the photonic IC with grooves that support the optical fibers. The substrate and photonic IC can have metal bumps that cooperate to provide mechanical bonding and electrical connections between the substrate and photonic IC. Portions of the optical fibers supported by the substrate grooves can define flat surfaces spaced from the optical fiber cores. The photonic IC can include passive waveguide structures with a first coupling section that interfaces to the flat surface of a corresponding optical fiber (for evanescent coupling of optical signals) and a second coupling section that interfaces to a corresponding in-plane waveguide (for adiabatic spot-size conversion of optical signals). |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
CN000001685256A
US000005907649A
US000006879757B1
US000007303339B2
US000007603021B2
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
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|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
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Prüfstoff-IPC |
ICP |
|
