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Dokument US020060118852A1 (Seiten: 15)

Bibliografische Daten Dokument US020060118852A1 (Seiten: 15)
INID Kriterium Feld Inhalt
54 Titel TI [EN] Process for patterning capacitor structures in semiconductor trenches
71/73 Anmelder/Inhaber PA RUEB MICHAEL
72 Erfinder IN RUEB MICHAEL, AT
22/96 Anmeldedatum AD 09.11.2005
21 Anmeldenummer AN 27028205
Anmeldeland AC US
Veröffentlichungsdatum PUB 08.06.2006
33
31
32
Priorität PRC
PRN
PRD
DE
102004054352
20041109
51 IPC-Hauptklasse ICM H01L 29/94 (2006.01)
51 IPC-Nebenklasse ICS
IPC-Zusatzklasse ICA
IPC-Indexklasse ICI
Gemeinsame Patentklassifikation CPC H01L 29/66181
H10B 12/0387
MCD-Hauptklasse MCM H01L 29/94 (2006.01)
H10B 12/00 (2023.01)
MCD-Nebenklasse MCS
MCD-Zusatzklasse MCA
57 Zusammenfassung AB [EN] A process for producing structures in a semiconductor zone, has the steps of a) producing a trench ( 2 ) in the semiconductor zone ( 18 ), b) filling the trench with a photoresist ( 19 ), and c) exposing the photoresist ( 19 ) using ion beams ( 20 ), d) developing the photoresist ( 19 ). The energy density and ion dose for the ion beams ( 20 ) are selected in such a way that the photoresist ( 19 ) is only chemically changed at defined depths, so as to produce two regions, in the first region ( 21 ) of which the photoresist has been chemically changed at the defined depths by the ion beams ( 20 ), and in the second region of which the photoresist has been left chemically unchanged, so that during the developing step the photoresist is removed in precisely one of the two regions.
56 Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt
CT US000004673962A
US000004871688A
US000004905065A
US000005394000A
US000005593908A
US000006552382B1
US000006573558B2
US000006608350B2
US000006723611B2
US020030016569A1
56 Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt
CT
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt
CTNP
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt
CTNP
Zitierende Dokumente Dokumente ermitteln
Sequenzprotokoll
Prüfstoff-IPC ICP H01L 27/08 CF
H01L 29/06
H01L 29/78