Bibliografische Daten

Dokument US000006649459B2 (Seiten: 17)

Bibliografische Daten Dokument US000006649459B2 (Seiten: 17)
INID Kriterium Feld Inhalt
54 Titel TI [EN] Method for manufacturing a semiconductor component
71/73 Anmelder/Inhaber PA INFINEON TECHNOLOGIES AG, DE
72 Erfinder IN DEBOY GERALD, DE ; FRIZA WOLFGANG, AT ; HAEBERLEN OLIVER, AT ; RUEB MICHAEL, AT ; STRACK HELMUT, DE
22/96 Anmeldedatum AD 26.03.2001
21 Anmeldenummer AN 81759401
Anmeldeland AC US
Veröffentlichungsdatum PUB 18.11.2003
33
31
32
Priorität PRC
PRN
PRD
DE
19843959
24.09.1998
33
31
32
PRC
PRN
PRD
DE
9903081
24.09.1999
51 IPC-Hauptklasse ICM H01L 21/338
51 IPC-Nebenklasse ICS H01L 21/8236
H01L 21/8242
IPC-Zusatzklasse ICA
IPC-Indexklasse ICI
Gemeinsame Patentklassifikation CPC H01L 21/26586
H01L 29/0619
H01L 29/0623
H01L 29/0634
H01L 29/0649
H01L 29/0653
H01L 29/1095
H01L 29/41766
H01L 29/78
H01L 29/7802
MCD-Hauptklasse MCM
MCD-Nebenklasse MCS H01L 21/336 (2006.01)
H01L 29/06 (2006.01)
H01L 29/10 (2006.01)
H01L 29/78 (2006.01)
MCD-Zusatzklasse MCA H01L 21/265 (2006.01)
57 Zusammenfassung AB [EN] The invention relates to a method for producing a semiconductor component including semiconductor areas of different conductivity types which are alternately positioned in a semiconductor body. The semiconductor areas of different conductivity types extend at least from one first zone to a position near a second zone. Because of variable doping in trenches and in the trench fillings, an electric field is generated which increases from both the first zone and the second zone.
56 Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt
CT US000005021355A
US000005384152A
56 Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt
CT DE000004309764A1
DE000019736981A1
US000005216275A
US000005438215A
WO001997029518A1
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt
CTNP
56 Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt
CTNP Chen Xingbi: "Theory of a Novel Voltage Sustaning (CB) Layer for Power Devices", Chinese Journal of Electronics, vol. 7, No. 3, Jul. 1998, pp. 211-216. 1
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Prüfstoff-IPC ICP H01L 21/336