| 54 |
Titel |
TI |
[DE] Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils
[EN] Electronic component and method of forming an electronic component
[FR] Composant électronique et procédé de formation de composant électronique |
| 71/73 |
Anmelder/Inhaber |
PA |
CONTINENTAL AUTOMOTIVE GMBH, DE
;
SCHREINER GROUP GMBH & CO KG, DE
|
| 72 |
Erfinder |
IN |
HARTAUER ANDREA, DE
;
HORN RUEDIGER, DE
;
REHSE NICOLAUS DR, DE
;
RUEBEKEIL MARKUS, DE
;
STOIAN LIVIU ACHIM, RO
;
VLAD SEBASTIAN REMUS, RO
|
| 22/96 |
Anmeldedatum |
AD |
24.08.2009 |
| 21 |
Anmeldenummer |
AN |
09168501 |
|
Anmeldeland |
AC |
EP |
|
Veröffentlichungsdatum |
PUB |
09.03.2011 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
|
| 51 |
IPC-Hauptklasse |
ICM |
H05K 3/28
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
H01L 21/00
(2006.01)
H01L 23/31
(2006.01)
H05K 3/34
(2006.01)
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
H01L 2224/16
H01L 2924/3025
H05K 2201/0129
H05K 2201/10689
H05K 2203/1105
H05K 2203/1311
H05K 3/284
|
|
MCD-Hauptklasse |
MCM |
H05K 3/28
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
H01L 21/00
(2006.01)
H01L 23/31
(2006.01)
H05K 3/34
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] The invention provides an electronic component (10) comprising:
- a circuit board (1),
- at least one semiconductor device (2) mounted on the circuit board (1) and protruding above a surface (1A) of the circuit board (1) and
- a synthetic foil (5) covering the semiconductor device (2) and further covering at least a surface region (11) of the surface (1A) of the circuit board (1) laterally surrounding the semiconductor device (2),
- wherein the synthetic foil (5) is formed of a material mainly comprised of a thermoplast and
- wherein the synthetic foil (5) is formed as a pocket (15) conforming to an outer shape of the semiconductor device (2) and comprising a circumferential portion (5b) which extends from an outer surface (2A) of the semiconductor device (2) to the surface (1A) of the circuit board (1) and which abuts the surface region (11) laterally surrounding the semiconductor device (2). |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
LU000000068391A1
DE000001764266A
DE102006040724A1
JP000H04268793A
US000003388465A
US020020036898A1
US020030091842A1
WO002008037508A1
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
ANONYMOUS: "Conformal plastic sheet coating for protection & holding of components", RESEARCH DISCLOSURE, MASON PUBLICATIONS, HAMPSHIRE, GB, vol. 338, no. 84, 1 June 1992 (1992-06-01), XP007117834, ISSN: 0374-4353 0
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
H01L 21/00
H01L 23/31
H05K 3/28
|
