| 54 |
Titel |
TI |
[DE] Kühlkörper mit mehreren sequentiell durchflossenen Kühlzonen
[EN] Electronic component e.g. integrated circuit, surface cooling device for computing system, has heat exchange chamber through which fluid flows, where surfaces of chambers are segmented to sequentially draining zones |
| 71/73 |
Anmelder/Inhaber |
PA |
Aqua Computer GmbH & Co. KG, 37130 Gleichen, DE
|
| 72 |
Erfinder |
IN |
|
| 22/96 |
Anmeldedatum |
AD |
20.04.2007 |
| 21 |
Anmeldenummer |
AN |
202007005837 |
|
Anmeldeland |
AC |
DE |
|
Veröffentlichungsdatum |
PUB |
30.08.2007 |
33
31
32 |
Priorität |
PRC
PRN
PRD |
|
| 51 |
IPC-Hauptklasse |
ICM |
F28F 13/06
(2006.01)
|
| 51 |
IPC-Nebenklasse |
ICS |
G06F 1/20
(2006.01)
H01L 23/473
(2006.01)
H05K 7/20
(2006.01)
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
F28F 3/12
H01L 23/473
H01L 2924/0002
|
|
MCD-Hauptklasse |
MCM |
F28F 13/06
(2006.01)
|
|
MCD-Nebenklasse |
MCS |
G06F 1/20
(2006.01)
H01L 23/473
(2006.01)
H05K 7/20
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
|
| 57 |
Zusammenfassung |
AB |
[EN] The device has heat exchange chambers (4) via which fluid flows. The chambers are spatially separated from one another. A metallic base (1) is connected with a housing of a cooling body (2). The chambers transfer the heat of heat sources to the fluid. A cooling medium flows to one chamber through a nozzle (5) and is then led to next chamber. The surfaces of the chambers are segmented to several sequentially draining zones. |
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
in Recherche ermittelt |
CT |
|
| 56 |
Entgegengehaltene Patentdokumente/Zitate,
vom Anmelder genannt |
CT |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
in Recherche ermittelt |
CTNP |
|
| 56 |
Entgegengehaltene Nichtpatentliteratur/Zitate,
vom Anmelder genannt |
CTNP |
|
|
Zitierende Dokumente |
|
Dokumente ermitteln
|
|
Sequenzprotokoll |
|
|
|
Prüfstoff-IPC |
ICP |
F28F 13/06
G06F 1/20
H01L 23/473
H05K 7/20 B
|
