54 |
Titel |
TI |
[DE] Bauelement für die Herstellung von Fußböden [EN] Ground plate for construction of floors - comprises hollow space formed by support feet and floor lining, space being filled with flowable material through holes in lining |
71/73 |
Anmelder/Inhaber |
PA |
Holzem, Günther, 5357 Swisttal, DE
|
72 |
Erfinder |
IN |
Holzem, Günther, 5357 Swisttal, DE
|
22/96 |
Anmeldedatum |
AD |
19.02.1991 |
21 |
Anmeldenummer |
AN |
4104979 |
|
Anmeldeland |
AC |
DE |
|
Veröffentlichungsdatum |
PUB |
27.08.1992 |
33 31 32 |
Priorität |
PRC PRN PRD |
|
51 |
IPC-Hauptklasse |
ICM |
E04F 15/02
|
51 |
IPC-Nebenklasse |
ICS |
|
|
IPC-Zusatzklasse |
ICA |
|
|
IPC-Indexklasse |
ICI |
|
|
Gemeinsame Patentklassifikation |
CPC |
E04F 15/18
E04F 15/182
E04F 2015/02111
|
|
MCD-Hauptklasse |
MCM |
|
|
MCD-Nebenklasse |
MCS |
E04F 15/18
(2006.01)
|
|
MCD-Zusatzklasse |
MCA |
|
57 |
Zusammenfassung |
AB |
[DE] Das Bauelement besteht aus einem Unterboden (Grundplatte) - vorzugsweise als Schallschutz- und Wärmedämmschicht -, einem Hohlraum, der beispielsweise durch Stützfüße gebildet wird, und einem Bodenbelag. Der Hohlraum wird durch Öffnungen im Bodenbelag mit einem fließfähigen Werkstoff verfüllt. [EN] The ground plate (2) consists of a sound-proofing and heat insulating layer, has an inclination, and a groove (8) at its edges. It overhangs the floor lining (7) at its outer edges by half a seam width. It also has a hollow space (4) formed by distance supports (6) fixed to it and the floor lining (7). On its upper side is a damp protecting layer (3) which projects over its edges. The seams of the floor lining are closed on the underside, and are closed on its upper side by seam filling bodies (13). All the components are joined to one another by form coupling strips (9) which are inserted in the grooves of the ground plate. Movement seams are produced by fitting movement seam form pieces (10) in the ground plate groove between the components, and wall connections are formed by introducing edge strips (11) in the ground plate grooves. USE/ADVANTAGE - For the simplification and rationalisation of the structure of floors in buildings. |
56 |
Entgegengehaltene Patentdokumente/Zitate, in Recherche ermittelt |
CT |
DE000002314922B
DE000002639471A1 EP000000156247A2
|
56 |
Entgegengehaltene Patentdokumente/Zitate, vom Anmelder genannt |
CT |
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56 |
Entgegengehaltene Nichtpatentliteratur/Zitate, in Recherche ermittelt |
CTNP |
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56 |
Entgegengehaltene Nichtpatentliteratur/Zitate, vom Anmelder genannt |
CTNP |
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Sequenzprotokoll |
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Prüfstoff-IPC |
ICP |
E04F 15/02
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